Search results for "Master Bond"
Relec 9” TFT screens
Increased demand for screens in equipment has led to problems for equipment manufacturers looking for something larger than the conventional 7” displays but who are reluctant to increase the size, or cost, to integrate a 10” screen.
Aviators recognised in annual Honourable Company of Air Pilots Trophies and Awards
The leadership, technical ability, and flying skill of a leading test pilot have been recognised by the Honourable Company of Air Pilots as being fundamental to the success of Rolls-Royce’s record breaking electric Accel flight, which propelled the futuristic aircraft into the history books.
Fira de Barcelona celebrates the extension of MWC Barcelona
Fira de Barcelona expressed its satisfaction following the GSMA's announcement to extend the MWC Barcelona in the Catalan capital through 2030.
Rework of LED dies using debonding solution
In times of limited availability of components and materials, reworking takes on a very special significance. This also applies to LED manufacturing, where irregularities in processed LEDs are immediately visible at first sight.This piece from Tresky discusses how its automated debonding solution can enhance LED manufacturing.
Trovidur EC-FR White meets fire specifications
With the colour variant Trovidur EC-FR White FR1130, the international plastics processor Röchling Industrial SE & Co. KG is expanding its product range to include materials that can be used safely in the semiconductor and solar industries
Lorin highlights AnoGrip Anodised Aluminium
Lorin Industries, global industry specialist in the innovation and production of coil anodised aluminium, highlights its AnoGrip anodised aluminium product that accepts all types of adhesives without the need for primer or pre-treatment.
WIN Semiconductors releases 0.1µm GaAs pHEMT Technology
WIN Semiconductors, a compound semiconductor foundry, announces the release of its 0.1µm pHEMT technology, PP10-20.
European Rover Challenge winners at the International Astronautical Congress
The dust has not yet settled on the Marsyard, and neither has the huge excitement after the finals of the 8th edition of the European Rover Challenge.
Digitally printing dense micron-sized materials on flat and non-flat surfaces
Additive manufacturing (AM) offers tremendous possibilities for the fabrication of next-generation microelectronic devices, including lower cost and simplicity. Yet, there are several challenges to the widespread use of AM techniques for microfabrication. Łukasz Kosior from XTPL further discusses.
Dow launches interactive platform to connect end-to-end silicone solutions for 5G networks
Dow globally launches 5G.Dow.com, an engaging, guided selection tool that allows customers to find the application-specific silicone solutions they need for their 5G-enabled technology.