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Renesas, a premier supplier of advanced semiconductor solutions, has announced a new development board for automotive gateway systems.

Harwin has expanded its range of ready-to-use cable assemblies for the high reliability range of Gecko connectors with the addition of cable assemblies for the Gecko-SL connectors which feature Screw-Lok (SL) jackscrew fixings.

Siemens Digital Industries Software announces that it will expand its Strategic Collaboration Agreement (SCA) with Amazon Web Services (AWS) to focus on helping mutual integrated circuit (IC) and electronics design customers leverage AWS’s advanced cloud services to shorten design cycles, optimise engineering resources, and boost verification coverage using current and forthcoming Siemens EDA products.

Review Display Systems (RDS) has announced the introduction of a new ATX motherboard from embedded computing solutions supplier AAEON.

Littelfuse has announced the release of its AEC-Q200 Rev E Qualified Fuses, specifically designed for the demanding circuit protection needs of compact automotive electronics and EV applications.

Renesas and Wolfspeed have announced the execution of a wafer supply agreement and $2 billion deposit by Renesas to secure a 10 year supply commitment of silicon carbide bare and epitaxial wafers from Wolfspeed.

Toshiba has released a new photovoltaic output photocoupler with an enhanced open-circuit voltage.

If you plan on attending theSemicon West show inSan Francisco, CAthis year, make sure you stop bytheSeica booth.

Harwin has announced the signing of a new supply channel partnership. The company has added Transfer Multisort Elektronik (TME) to its extensive distribution network.

Chih-Jen Shih and Andrew deMello, chemical engineers from ETH Zurich, have spearheaded a project to create a fast-testing system using advanced graphene paper.