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Joe Kunsch, Head of the Business Unit IR Components at LASER COMPONENTS Germany will unveil exciting new detector technology on January 30th, 4:20-4:40pm PST at Photonics West.

congatec is now including the Hypervisor in all of its new x86 Computers-on-Modules (COMs).

Although there have been significant advances in competing capacitor technologies such as hybrid types, electrolytic capacitors may still remain the best solution for many applications, explainsShahrokh Kananizadeh, Senior Product Manager, Panasonic Industry Europe.

Work from home (WFH) might be said to be the one good thing to come out of the COVID-19 crisis, especially considering that the major world events to follow the pandemic have been inflation and war. Yet, like all good things, it is coming to an end… or is it?

Ventec has announced that its VT-901 polyimide material is now fully and exclusively qualified by ESA in ACB Belgium’s manufacture of High-Density Interconnect (HDI) PCBs.

OpenOcean, IQM, and Lakestar have now released their State of Quantum 2024 report, which draws insights from contributors such as Goldman Sachs, Wells Fargo, HSBC, Moderna, Sonos, Siemens, and Centrica, to underpin the shifting tides in the quantum sector, from finance to the future of the technology.

With the rise of generative AI driving demand for advanced chips and memory semiconductors to process and store massive amounts of data, the stage is set for SEMICON Korea 2024, opening 31st January 2024 at COEX in Seoul to highlight innovations shaping the future.

Advantech has introduced the new WISE-4250 dual band-based industrial Wi-Fi I/O module with integrated sensors.

Rapid advancements in compute intensive applications have raised the bar for a faster, more efficient, and scalable network.

Richardson Electronics announced today a global agreement has been reached with Microwave Components (MCI).