Search results for "miniaturisation"

A prototype for an interactive mobile device, called Cubimorph, which can change shape on-demand will be presented this week at ICRA 2016, in Stockholm, Sweden, 16th-21st May.The research led by Dr Anne Roudaut from the Department of Computer Science at the University of Bristol, in collaboration with academics at the Universities of Purdue, Lancaster and Sussex, will be presented at the International Conference on Robotics and Automation (ICRA),...

Rapid development within the electronics industry has inevitably led to increased performance requirements for components along with a trend towards miniaturisation, finer spacing and high integrity. PCBCart, an international custom PCB fabrication and assembly service supplier, explain.

ERNI has expanded its miniature 0.8mm MicroStac SMT connector series to include anti-magnetic versions with 12-pin (single row) and 54-pin (dual row) configurations with a 5mm board-to-board stack height and a 1.5mm effective wipe length. The non-ferrous connectors are designed specifically for medical and instrumentation applications such as MRI machines, where ferrous materials can be hazardous and degrade test results.

Bespoke high-voltage power solutions for UK and European customers seeking to develop highly miniaturised scientific equipment, such as mass spectrometers for use in laboratories and medical centres have been introduced by Luso Electronics. Through its partnership with US-based HVM Technology, Luso already distributes standard and customised military grade high-voltage power converters and compact power supplies for night vision applications.

Fischer Connectors has launched an even smaller ultra-miniature connector, MiniMax 06, as an extension of its miniature high-density product range, the Fischer MiniMaxTM series. The MiniMax 06 connector can include up to 12 power and signal contacts in a footprint of only 10mm. This corresponds to a density factor of 0.83 - a unique technological feature for a connector with standard 0.5 mm contacts.

Small, reliable, high-voltage GaN power switching transistors from GaN Systems are provided in compact GaNPX packages for integration into power and wireless modules, media codecs and high signal integrity applications, such as sensors and amplifiers.

ROHM Semiconductor has introduced an SiC power module rated at 1,200V/180A based on the company’s completely inhouse supply chain capacities and advanced packaging capabilities. The BSM180D12P3C007 half-bridge SiC module integrates mass-produced trench-type SiC MOSFETs and SiC SBDs in the same footprint as previous modules.

Researchers at Chalmers University of Technology in Sweden have developed a new approach to cooling electronics using graphene nanoflake-based film. By Rachel Gordon, Technology Analyst, IDTechEx.

Computers are often described with "ones and zeros," referring to their binary nature: each memory element stores data in two states. But there is no fundamental reason why there should be just two. In a study, researchers have designed a magnetic element that has six stable magnetic states, which paves the way toward realising a six-state magnetic memory element.

Mie Fujitsu Semiconductor (MIFS) and CSEM have penned a joint development agreement to cooperate in the development of Deeply Depleted Channel (DDC) and near/sub-threshold technologies for the IoT/Wearables market. The agreement encompasses the development of ultra-low voltage, ultra-low power standard cell libraries, power management cells and memories as well as the development of a representative qualification vehicle to showcase the technolog...