Search results for "Master Bond"
Getting close up to fibre optic sensors
Fibre optic sensors are often favoured in electronics applications for their high switching speeds and ability to detect tiny objects.
Intertronics launches PZ3-i surface treatment device
New automatable cold plasma surface treatment technology
SEMI auto IC (integrated circuit) master guide announced
SEMI Taiwan has launched the SEMI Auto IC Master, a comprehensive guide to automotive semiconductor and component providers in Taiwan. The guide promises to help automakers better adapt production capacity to semiconductor supply chain disruptions and drive innovation.
Comparison of printed tattoo electrodes for biomedical applications
Experimenting in the world of Flexible Hybrid Electronics (FHE) comes with a variety of hurdles. Printing technologies are vastly different in terms of materials compatibility and have pros and cons that make them suitable for particular applications.
GIGABYTE Launches Four AMD X670 Motherboards
GIGABYTE is proud to launch its X670E and X670 series motherboards, which support AMD’s recently announced Ryzen 7000 series desktop processors based on the next-gen Zen 4 architecture.
Bonding with maximum precision
ASMPT Semiconductor Solutions (SEMI), a maker of mainstream and advanced equipment for semiconductor assembly and packaging, will exhibit its products at the Electronica 2022 trade fair being held 15 – 18 November 2022 in Munich.
Intertronics busts cyanoacrylate adhesive myths
Cyanoacrylate adhesives (CAs), also known as superglues, are unique in that they are the only fast curing adhesive that is single component and can cure in ambient conditions with no external energy source.
Anritsu introduces the IQ Signal Master
Anritsu introduces the IQ Signal Master MX280005A Vector Signal Analysis software that delivers expanded post-processing measurements and analysis of IQ data files captured on Anritsu Field Master Pro MS2090A, Remote Spectrum Monitor MS27201A, and Remote Spectrum Monitor MS2710xA spectrum analysers.
Relec breaks the boundaries with 9″ TFT screens
Relec Electronics adds three 9″ TFT screens for equipment engineers looking for a better surface area to work with than that provided by conventional 7″ displays – without the expense associated with 10″ models.
Epoxy encapsulant resists arcing without igniting
Master Bond EP21AC is a two part epoxy with a non-halogenated filler that is formulated for applications where arc resistance and flame retardancy are required.