Search results for "capacitor"
Smart thinking in factories and EVs
The embedded electronics development community is currently experiencing the biggest changes in our industry since the creation of the IC, argues Khagendra Thapa.
DIN rail mount buffer module has a narrow 49mm width
TDK has introduced the TDK-Lambda DBM20 DIN rail mount 24V 20A buffer module. The buffer module provides short term hold-up or peak power for loads connected to a 24Vdc output AC/DC power supply. It can supply an additional 250ms hold-up at 448W output power, or two seconds with a 2.5A load.
Low ESL chip MLCCs for ADAS applications
Murata has introduced the ultra-thin LW reversed, low equivalent series inductor (ESL) multilayer ceramic capacitors (MLCCs) with a capacitance value of 1.0µF ±20% for 4VDC-rated automotive applications.
Motor driver ICs optimised for automotive deployment
Toshiba Electronics has just announced two new driver ICs for brushed DC motors. The TB9054FTG and TB9053FTG utilise advanced DMOS FET technology to achieve a low RDSON value. These H-bridge devices are AEC-Q100 Grade 1 qualified and support temperatures up to 150°C junction temperature.
MLCCs mitigate tin whisker formation
A new series of surface-mount multilayer ceramic chip capacitors (MLCCs) has been introduced by Vishay Intertechnology.
MLCCs mitigate tin whisker formation
A new series of surface-mount multilayer ceramic chip capacitors (MLCCs) has been introduced by Vishay Intertechnology.
3,600µF to 40,000µF wet tantalum capacitor
New Yorker Electronics has released Vishay’s newly extended EP1 Wet Tantalum Capacitor, supplying the industry’s highest capacitance per voltage-rating for this device type.
Chipset specific integrated passive devices for IoT
For the next generation of low-cost, battery operated, wireless IoT products, the design goal is to provide RF signal range and stability, while also reducing power consumption, in a miniaturised package. As a result, RF chipset manufacturers are increasingly fine-tuning and improving their products. Johanson Technology has released a chipset specific integrated passive device designed to do just this.
Impedance-matching simplifies portable GNSS receivers
STMicroelectronics’ BPF8089-01SC6 RF front-end forGNSS receivers (Global Navigation Satellite System) have simplified design and saved real-estate by integrating the impedance-matching and electrostatic-discharge (ESD) protection circuitry typically implemented using discrete components.
Hybrid supercapacitors offer eight times higher energy density
The new HS/ HSL Hybrid Supercapacitors from Eaton provide a power density that is up to three times that of lithium-ion batteries. They are available at Rutronik UK.