Search results for "advanced engineering"
Moxa demonstrates simple and secure factory automation at SPS 2024
Location: Hall 5, Booth 210 (Partner stand with PROFINET International) Moxa Europe GmbH, a provider of industrial communication and networking solutions, is set to showcase its latest innovations in industrial switches at the upcoming SPS 2024 event, taking place from November 12 to 14, 2024, in Nuremberg. At the PROFINET International (PROFIBUS & PROFINET International) partner stand, Moxa will present solutions designed to simplify and enh...
MediaTek introduces Dimensity 9400 SoC for the latest AI experiences
MediaTek has introduced the Dimensity 9400, its latest smartphone chipset, designed specifically for optimisingEdge-AI applications. Managing Editor Paige West attended a press talk to learn more.
Lucid Motors Selects Everspin’s PERSYST MRAM for Gravity Electric SUV
Everspin Technologies, Inc. (NASDAQ: MRAM), a leading developer of Magnetoresistive Random Access Memory (MRAM) solutions, has announced that Lucid Motors will integrate its PERSYST MRAM technology into the newly launched Gravity SUV. The chosen memory, Everspin’s MR25H256A, is a 256Kb serial MRAM designed to meet the stringent AEC Q100 Grade 1 specification, ensuring reliable operation across a temperature range of -40°C to 125°C. ...
SEGGER expands emFile with Microsoft exFAT support
SEGGER has announced the integration of Microsoft exFAT support into its emFile system, a fail-safe file system designed for embedded applications. With this enhancement, emFile is now capable of supporting volumes formatted with either FAT or exFAT, allowing it to efficiently handle files of virtually any size. emFile’s design is tailored for embedded systems, offering optimized memory usage in both RAM and ROM, high-speed performance, and...
e-con Systems launches hot-pluggable GMSL HDR camera
e-con Systems, a provider of OEM camera solutions with over 20 years of vision experience, is proud to announce the launch of STURDeCAM34 – an IP69K-rated 3MP automotive multi-camera designed for the most demanding applications in the automotive and industrial domains.
Omron introduces high-power PCB relay
Omron Electronic Components Europe has introduced the G7EB-E2 high-power PCB relay, an advanced version of the G7EB series.
Insights from BEIS shares insights into smart lighting
BEIS Strategic Consultancy has released new insights highlighting the impact of smart lighting technology on the global lighting industry.
Bourns adds new high current GDT modules
Bourns has introduced two new high-current gas discharge tube (GDT) series to its high energy GDT range.
Silicon Labs Series 3 Platform guides the evolution of the IoT
Silicon Labs, a pioneer in secure, intelligent wireless technology for a more connected world, delivered the opening keynote for the inaugural embedded world North America, with CEO Matt Johnson and CTO Daniel Cooley discussing how AI is driving a revolution in IoT, while detailing the continued success of the company’s growing Series 2 platform and upcoming Series 3 platform.
Greenliant brings high endurance to NVMe M.2 ArmourDrive SSDs
Greenliantis now sampling high-endurance EnduroSLC NVMe M.2 2242 and 2280 ArmourDrive EX Series solid state drives (SSDs), providing 75,000 and 150,000 program-erase (P/E) cycles.