Search results for "Qualcomm"
Agilent Signs Licensing Agreement with Qualcomm for Factory Test Technology
Agilent announced that they have entered into a licensing agreement with Qualcomm Inc. for factory test technology. Under the terms of the agreement, Qualcomm granted Agilent a worldwide license to demonstrate and distribute products that leverage the Qualcomm technology for RF factory testing. The agreement makes Agilent among the first test equipment vendors in the industry to license Qualcomm's factory test technology.
NXP Showcases Technology and Lifestyle Innovation at CES 2010
Innovation continues to remain a hot topic and is considered the essence of a prospering economy. NXP Semiconductors will be showcasing a wide range of innovations at this year’s Consumer Electronics Show (CES) in Las Vegas, spanning across the digital home, automotive and industrial spectrum. Through cutting edge semiconductor technology provided by NXP, the company is bringing an affordable and intelligent technology experience to every consu...
Synopsys and IEEE-ISTO launch industry body to evolve Interconnect Modeling Standard
Synopsys, Inc. today announced the open source availability of its widely used Interconnect Technology Format (ITF) for parasitic modeling and the formation of a technical advisory board (TAB) under the auspices of IEEE Industry Standards and Technology Organization (IEEE-ISTO). The purpose of the Interconnect Modeling TAB (IMTAB) is to facilitate the evolution of ITF and promote an interoperable interconnect modeling format to address the indust...
Digi Launches Industry's First System-on-Module with Global 3G Cellular Connectivity
Digi International introduced the ConnectCore 3G, the industry’s first embedded module with integrated application processing and Qualcomm Gobi technology. Gobi technology supports High Speed Packet Access (HSPA) or Evolution-Data Optimized (EV-DO) networks, the two dominant standards for 3G data networks, from the same cellular radio. Ideal for developing remote device management solutions in energy, fleet management, digital signage, industr...
Magma Congratulates Winners of the MUSIC India 2011 “Best Paper” Awards
Magma® Design Automation Inc.announced the “Best Paper” winners for MUSIC – Magma Users Summit on Integrated Circuits held here on September 7. Over 200 Magma users attended the annual event that featured 11 papers, a keynote by Balajee Sowrirajan, director of IC Engineering in the OMAP Business Unit at Texas Instruments, and a presentation given by Magma CEO Rajeev Madhavan.
RFMD Expands Family of Transmit Modules for 3G Entry Phones
RF Micro Devices, Inc. today announced the addition of four new products to RFMD's portfolio of 3G transmit modules. The four new products – the RF3230, RF3231, RF3232, and RF3171 – are designed to accelerate the implementation of 3G entry-level feature phones supporting one-to-two bands of WCDMA and two-to-four bands of GSM/GPRS (also referred to as WGPRS). Each new transmit module (TxM) features a GSM/GPRS power amplifier (PA) and an integr...
RFMD Commences Volume Production of WCDMA/HSPA+ Power Amplifiers
RF Micro Devices, Inc. announces it has commenced high-volume production of its RF720x WCDMA/HSPA+ power amplifiers (PAs). RFMD's RF720x product family is comprised of seven high performance PAs designed for smartphones and 3G devices implementing mode-specific, band-specific front end architectures. The RF720x product family accommodates all major WCDMA/HSPA+ bands and band combinations and is optimized to mate with reference designs from Qualco...
Huawei and Qualcomm Drive Commercial HSPA+ Technology with Speeds of 42Mb/s
Huawei, a leader in providing next-generation telecommunications network solutions for operators around the world, today announced, along with partner Qualcomm, the successful completion of one of the industry' s first interoperability tests on dual carrier HSPA+ (High Speed Packet Access Plus) technology. The test, which reached a peak downlink data rate of 42Mb/s, the fastest downlink rate experienced by 3G end-users, demonstrates that dual-car...
Huawei - MediaPad 7-inch Android 3.2 Honeycomb Dual-Core Tablet
Huawei, a leading telecom solutions provider, today launched the Huawei MediaPad, the world's first 7-inch Android 3.2 Honeycomb tablet. The MediaPad is a complete entertainment powerhouse driven by Qualcomm's dual-core 1.2GHz processor, supported by Huawei Device's Hi-Space cloud solution and Google Android Market. The MediaPad provides a fabulous user-experience in a stylish, high-performing and ultra-portable package.
First Electric Vehicle Wireless Charging Trial Announced for London
Qualcomm Incorporated today announced the first Wireless Electric Vehicle Charging (WEVC) trial for London in what is a UK and industry-leading initiative. Qualcomm is collaborating with the UK Government, as well as the Mayor of London’s office and Transport for London (TfL) to deliver the trial.