Search results for "IBM"

The next phase of semiconductor designs will see the adoption of 3D IC packages, vertical stacks of multiple bare die connected directly though the silicon. But TSVs complicate the test process and there is no time to waste in finding solutions. By Stephen Pateras.

INCHRON GmbH, a leading manufacturer and supplier of design and test solutions for real-time critical software in embedded systems, will be staging the international Real-Time Congress for the third year running in Munich. The theme of this year's event is risk management in projects with real-time-critical applications.

Lantronix, Inc. today announced the launch of its new patent-pending xPrintServer, the first Apple iOS print server compatible with the iPad2, iPad, iPhone, iPod touch, and virtually any device running Apple’s iOS mobile operating system.

New Scale Technologies has named industry veteran David Simpson to the newly-created position of vice president of marketing and sales. Simpson has 24 years of experience in sales and marketing of technical products and services. Most recently with New Scale's strategic partner austriamicrosystems, he was instrumental in introducing New Scale's SQUIGGLE micro motor to austriamicrosystems' worldwide direct sales force and distribution network. In ...

The Hybrid Memory Cube Consortium (HMCC), led by Micron Technology, Inc. and Samsung Electronics Co. Ltd. today announced that Microsoft Corp. has joined the consortium. The HMCC is a collaboration of original equipment manufacturers (OEMs), enablers and integrators who are cooperating to develop and implement an open interface standard for an innovative new memory technology called the Hybrid Memory Cube (HMC).

The Hybrid Memory Cube Consortium, led by Micron Technology and Samsung Electronics, have today revealed that its developer members have released the initial draft of the Hybrid Memory Cube interface specification to a rapidly growing number of industry adopters. Issuance of the draft puts the consortium on schedule to release the final version by the end of this year.

Addressing the incredible growth of data traffic in the cloud, Intel Corporation announced the record-breaking Intel Xeon processor E5-2600 product family. These new processors deliver leadership performance, best data center performance per watt1,4, breakthrough I/O innovation and trusted hardware security features to enable IT to scale. These processors are not only at the heart of servers and workstations, but will also power the next generati...

The MCGM data center is one of the largest data centers in Mumbai, India. Since the application is hyper-critical and requires 24 x 7 operation, the client sought a guaranteed power solution for this project. All critical IBM servers, networking equipment, access control systems, emergency lights, and security systems are connected to the Gamatronic Power+ with total load of 800 kVA.

Power-One has announced that it has signed a definitive agreement with Magnetek Inc. (NYSE: MAG) to acquire its Power Electronics Group. Magnetek specializes in the application of advanced power electronics technology to meet the needs of the global digital economy. Magnetek’s Power Electronics Group sells power supplies and alternative energy products to a wide range of customers and markets.

picoChip as announced that the Global Semiconductor Alliance (GSA – formerly the FSA – Fables Semiconductor Association) has appointed Guillaume d’Eyssautier, its President and CEO, to the GSA Board of Directors. In addition to his new role, Mr. d′Eyssautier will continue to serve on GSA’s Europe, Middle East and Africa Leadership Council (EMEA).