Search results for "eumw 2024"
Hyundai’s new electric vehicle can ‘crab’ drive sideways
Hyundai Mobis revealed its electric vehicle, the ‘MOBION’, at CES 2024. This EV features the innovative 'e-Corner System' motion technology.
ASMPT in the semiconductor climate consortium
ASMPT, the innovation and market pioneer in surface-mount and semiconductor manufacturing technology and a Leadership Level founding member of the Semiconductor Climate Consortium (SCC), has officially announced its Net Zero 2035 strategy for climate neutrality.
Who is Jim Keller and what's he doing at Tenstorrent?
Jim Keller, a name synonymous with groundbreaking developments in the computing world, just last September embarked on his latest technological endeavour as the CEO of Tenstorrent.
Calling all German Engineers!
Halbleiter Ankündigungen müssen nicht zwangsläufig eine Produktneugestaltung zur Folge haben Die Obsoleszenz von Komponenten muss nicht zwangsläufig ein neues Produktdesign bedeuten. Unsichere Marktbedingungen ändern immer die besten Geschäftspläne. Produktabkündigungen, Erweiterungen der Produktlebensdauer und verzögerte Produkteinführungen können zu einem Mehrbedarf bestimmter Komponenten f...
8-ch Isolated High Voltage Analog Input Module Reference Design
Thisreference design is a high-voltage analog input module with eight channels. Each channel can be used for both voltage and current measurement.
Cincoze slim embedded computers range
Cincoze continues to deepen its embedded computer range with two newly launched industrial computers (P2202 Series and P1201).
AMFitzgerald and MEMS Infinity join for piezoelectric MEMS acceleration
A.M. Fitzgerald (AMFitzgerald) and Sumitomo Precision Products (SPP)’s MEMS Infinity announced a strategic and technical partnership.
CUI Devices adds ac fans to thermal management portfolio
CUI Devices' Thermal Management Group announced the addition of ac fans to its product portfolio. The CAF family is a range of ac axial fans offering frame sizes of 120 mm or 172 mm and airflows from 44.69 to 164.5 CFM.
ASMPT unveil one of its most advanced die bonding systems
ASMPT has unveiled the new version of the AMICRA NOVA Pro in Munich on 17th January 2024. This state-of-the-art platform merges high placement accuracy with swift cycle times and cutting-edge bonding technologies, marking a significant advancement in the field.
Renesas debuts new dual-core Bluetooth SoC
Renesas has introduced the DA14592 Bluetooth Low Energy (LE) System-on-Chip (SoC) representing Renesas’ lowest power consumption and smallest, multi-core (Cortex-M33, Cortex-M0+), Bluetooth LE device.