Search results for "NXP"

With the rapid rise of automotive electronics, industrial 4.0, and smart home applications, new IoT edge devices and human-machine interface devices will require new functionality in terms of size, power consumption, and performance. In view of this, many MCU suppliers are developing new-generation MCUs with higher performance and lower power consumption to meet the market demand.

After slowing in the past couple years, semiconductor merger and acquisition activity strengthened in the first eight months of 2019 with the combined value of about 20 M&A agreement announcements reaching $28.0bn for the purchase of chip companies, business units, product lines, intellectual property (IP), and wafer fabs between January and the end of August.

CEVA has announced a significant milestone for its family of RivieraWaves wireless IoT technologies: surpassing 100 licensing deals signed for Bluetooth and WiFi IPs. This achievement reflects the tremendous growth in demand for Bluetooth and WiFi connectivity, particularly in IoT markets, with global tech market advisory firm ABI Research predicting that by 2023, more than 10 billion Bluetooth and WiFi enabled devices will ship annually.

congatec has introduced a new SMARC 2.0 Computer-on-Module with NXP i.MX 8M Mini processor. The conga-SMX8-Mini offers higher performance at significantly fewer watts due to the new 14nm FinFET structure. The module also offers impressive visualisation capabilities, including 3D graphics with full-HD resolution, despite low thermal and system cost.

Winbond Electronics has announced that its SpiStack dual-die NOR+NAND code storage product has been included on NXP Semiconductors FRWY-LS1012A board for use with its Layerscape LS1012A communications processor.

There is no question that the digitisation of all areas of life and work creates new business models. In the DACH region, the connection of digital transformation of products and manufacturing has been dubbed “Industrie 4.0” – industry 4.0. Obviously, this is not just about setting up a PC at the manufacturing line and hooking it up to the internet. Rather, the goal is to gain a competitive advantage, be it through raising effic...

With an industrial-strength Raspberry Pi starter kit, Kontron is laying the cornerstone for industrial and commercial use of the Raspberry Pi platform in companies and organisations. Can the board, known as a hobbyist PC and widely used as an experimental platform, really score points with its cheap image compared to high-quality standard industrial PCs?

Edge computing is becoming increasingly important for the Internet of Things (IoT) and Industry 4.0. Together with Edge technologies, standardised Computer-on-Module (COM), Single-Board-Computer (SBC), motherboards and systems ensure that computing power is available efficiently, quickly and flexibly. However, the processor should be suitable for the respective application.

Famed for its toolkits that ease implementation of the most advanced motion control and motor control, Trinamic has introduced an upgrade to its modular evaluation system with the interface board Landungsbrücke 2.0.Introduced in 2015, the modular evaluation system of Trinamicallows engineers to quickly implement and test different system designs for their application.

There are 3 major trends in the automotive industry that demands higher performance compute in the car. The next generation vehicle requires CAE (Connectivity, Automation and Electrification). Consider the vehicle a kind of consumer device with the level of connectivity and security requirements of networking equipment as well as the functional safety and reliability requirements of industrial equipment. Guest blog written by Ty Kim, Wind River.