Search results for "semiconductor"

Magnachip Semiconductor celebrated the opening ceremony of Magnachip Technology Company at its headquarters located in Hefei, China.

Leading semiconductor test equipment supplier Advantest has revealed the newest addition to its portfolio of power supplies for the V93000 EXA Scale SoC test platform.

Here, you can find out the key factors to consider when implementing GaN in power electronics design processing, and the challenges of doing so.

ROHM has developed Hall ICs, the BD5310xG-CZ / BD5410xG-CZ series, designed for automotive applications requiring magnetic detection.

The 35th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2024) opens with a focus on critical topics ranging from yield management and metrology to new developments in AI, smart manufacturing, and sustainability.

NI is set to deliver real-time semiconductor analytics solutions at the edge using its NI Global Operations (GO, formerly Optimal+) platform.

Fan out wafer level packaging (FOWLP) is an advanced semiconductor technology designed to enhance performance and miniaturise electronic devices.

British researchers, businesses, and academics will have enhanced access to future supercomputer research funding from 13th May 2024 as the UK joins the European High Performance Computing Joint Undertaking (EuroHPC).

DELO has developed a new, reliable sealant adhesive for CMOS image sensors, which are often used in driver monitoring systems.

Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, June 11-13, in Nuremberg, Germany.