Search results for "graphics"

Future Facilities has launchedRelease 15of its thermal simulation software, 6SigmaET. The latest version incorporates major developments that bring a series of new features, including enhanced views, optimised liquid cooling and one of the fastest GPU radiation calculations on the market.

Teledyne SP Device has announced the release of ADQ32 – a fourth-generation modular data acquisition board optimised for high-throughput applications. The combination of on-board open field-programmable gate array (FPGA) and high-speed data streaming makes it well suited even for the most computationally demanding applications.The dual-channel 12-bit digitiser supports synchronous sampling at 2.5 gigasamples per second (GS/s) on each channe...

Axiomtek has announced theMANO522, a mini-ITX motherboard powered by the LGA1151 socket 9th/8th generation Intel Core i7/i5/i3 processor (code name: Coffee Lake) with the Intel H310 chipset.

To assist with the initial development and prototyping of human machine interfaces (HMIs) based on its object-oriented graphic controller ICs, Bridgetek has announced availability of the ME817EV evaluation board. Featuring the company’s BT817 embedded video engine (EVE) device, it allows engineers to experiment with the latest generation of EVE technology and get a comprehensive understanding of the breadth of its capabilities.

Tasks at the embedded edge are getting more and more complex. Supporting up to eightcores and 16threads, the recently launched AMD Ryzen Embedded V2000 processors are hoping to pave the way for x86-based embedded designs with high compute density and performance per watt.

In a collaboration between Imagination Technologies and PaddlePaddle, Imagination’s IMGDNN API has been integrated into Paddle-Lite, growing the AI ecosystem for developers worldwide.

Nuvoton Technology Corporation Japan and Green Hills Software have announced the immediate availability of Green Hills Software’s INTEGRITY real-time operating system solution for the Nuvoton Gerda family of automotive SoCs (system-on-chips). The combined solution is a cost-optimised platform for OEMs and Tier 1s to build safe and secure, high-performance instrument clusters, heads-up displays, and e-mirrors.

In the space of 12 months, industry has changed completely. The way that manufacturers operate has fundamentally changed, bringing in a renewed need for embedded systems that support remote operations and contactless authentication and validation of the workforce. Here, Martin Frederiksen, Managing Director ofRecab UK, explores how 2020 brought new technologies to manufacturing plants.

Micron Technology has announced volume shipment of 1α (1-alpha) node DRAM products built using advanced DRAM process technology and offering major improvements in bit density, power and performance. This milestone reinforces Micron’s competitive strength and complements its recent innovations in graphics memory and 176-layer NAND.

Gordon E. Moore, one of the Co-founders of chipmaker Intel, predicted famously that the computing capacity of a microchip would double every two years, in what is now known as Moore’s Law. Despite having faster computers and phones, train passengers have in the past not been able to benefit from a stable internet access on their journey. Here, Martin Frederiksen, Managing Director ofRecab UK, explores the technological changes that will all...