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Researchers fromNanyang Technological University, Singapore (NTU Singapore)have developed the capability to use recycled glass in 3D printing, opening doors to a more environmentally sustainable way of building and construction.

Availability and full design support capabilities for a lineup of X-band GaN on SiC devices from Wolfspeed is announced by distributor Richardson RFPD.

Navitas Semiconductorthe industry leader in GaN power ICs, has announced a GaNFast Global Marketing Program with consumer electronics and accessory specialist UGREEN.

Infineon has added significant manufacturing capacities in the field of wide bandgap (SiC and GaN) semiconductors. The company is investing more than €2 billion to build a third module at its site in Kulim, Malaysia. Once fully equipped, the new module will generate €2 billion in additional annual revenue with products based on silicon carbide and gallium nitride.

In stock now at distributor RFMW is a high power amplifier module from Elite RF.

New MMICs and discrete devices deliver performance levels required in 5G, satellite communication and defence applications.

Hyundai Motor Group (HMG) has honoured Infineon Technologies AG as “Partner of the Year 2021” with the “Special Award for Supply Competence.”

A GaN FET-compatible analogue controller reduces bill of materials count and allows the design of a synchronous buck converter to be as simple as silicon FETs, says Zhihong Yu, senior staff manager, product marketing and applications engineering,Renesas Electronics America

“Tech up, cost down” is proudly on display at MACH 2022 as motion plastics specialist igus exhibits a new low-cost robot for small scale work and a novel solution for storing and shipping cable drums – both increasing efficiency but keeping costs down.

Electronic Specifier takes a look at the top boards/backplanes product stories to have been released in March 2022.