Search results for "electronica 2024"

Acer made several exciting announcements at Computex 2024, showcasing their latest advancements in technology across various product categories.

Sierra Space announced the successful completion of a rigorous environmental test suite on the Dream Chaser spaceplane, Tenacity, at NASA’s Neil Armstrong Test Facility in Sandusky, Ohio.

We are thrilled to express our heartfelt appreciation for your unwavering support of the 5th Edition Connected Africa Summit – Africa’s Premier Telecom Summit.

Collaboration and communication were key themes at the recent Hardware Pioneers event, as the industry faces challenges such as regulatory compliance and issues in cellular IoT connectivity that require close cooperation and information sharing.

Samtec, one of the service leaders in the connector industry, has announced the details of its participation in IMS 2024, the International Microwave Symposium Exhibition, to be held in Washington DC 18– 20 June 2024.

Environmental Services and Solutions Expo(ESS), the global event for the environmental services industry, has announced registration is now open with a limited number of early-bird free tickets available.

Innoscience will demonstrate its position in the GaN market at the upcoming PCIM conference and exhibition (Nuremberg, June 11-13).

Infineon has announced two new generations of high voltage (HV) and medium voltage (MV) CoolGaN devices which now enable customers to use Gallium Nitride (GaN) in voltage classes from 40V to 700V in a broader array of applications that help drive digitalisation and decarbonisation.

At IEEE ECTC 2024, imec presented a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such fine-grained die-to-wafer interconnects pave the way to logic/memory-on-logic and memory-on-memory applications. On the longer term, die-to-wafer bonding will enable also die- and wafer-level optical interconnects – for whi...

Toshiba will bring solutions that support customers’ goals in reducing their CO2 footprint at the PCIM 2024 conference and exhibition (Nuremberg 11th – 13th June).