Search results for "Qualcomm"

Qualcomm today announced its industry-leading Gobi 4G/LTE modem, the MDM9215, has been implemented in the SoftBank 102Z, a new mobile broadband router for Japan. The device, designed by Chinese telecommunications provider ZTE, represents the second generation of Gobi-powered 4G/LTE products from SoftBank Mobile and the first to feature MDM9x15 chipsets built on the 28nm manufacturing process.

Spirent has revealed that the Spirent 8100 Location Technology solution was used by Signals Research Group in the industry’s first independent benchmark study of the performance of location technologies in chipset platforms and leading smartphone models. The SRG report reveals significant performance differences in the Assisted GPS receive sensitivity of leading smartphones.

National Instruments has today announced the introduction of test solutions for 802.11ac WLAN and Bluetooth low-energy technology that combine NI graphical system design software and modular, FPGA-based PXI instrumentation to provide high-performance test capabilities that are completely user-programmable.

The finals of the free-to-enter Discovering Start-Ups 2012 take place on 21st November when entrants will have the unique opportunity to pitch their ideas, technologies and business plans to an impressive line-up of some 25 leading investors and industry figures from companies including Orange Labs, RIM, Qualcomm, Vodafone Ventures and Google.

Peregrine Semiconductor Corporation has announced the appointment of former Qualcomm executive Jeffrey Belk to its Board of Directors. Mr. Belk brings a wealth of industry experience to Peregrine's Board from his 14-year tenure at Qualcomm, where he held a variety of senior management positions, including his most recent role as senior vice president of strategy and market development. In this position, Mr. Belk examined changes in the wireless e...

Toshiba Electronics Europe today announced availability of three new bridge chips for use in mobile phones, a Mobile Industry Processor Interface (MIPI®) camera serial interface (CSI) to a Mobile Display Digital Interface (MDDI®) chip (part number TC358740XBG) and two MDDI-MIPI display serial interface (DSI) chips (part numbers TC358760XBG and TC358761XBG).

Analysis of findings from the recently published Semicast report “Opportunities for ARM in Embedded Processing—2011 Edition” suggest the rapid growth of the ARM architecture is set to continue over the medium term, with annual shipments of ARM-based processors set to match the world’s population this year and forecast to equal twice the world’s population in 2015.

Qualcomm Incorporated has announced expanded availability of the Company’s Femtocell Station Modem™ (FSM™) FSM9216, FSM9816 and FSM9832 enterprise chipsets, Qualcomm’s fully integrated system-on-chip (SoC) solutions for femtocell development with an extended user capacity of up to 32 active users.

National Instruments has today introduced the world’s first RF vector signal transceiver, the NI PXIe-5644R, and with it, a new class of software-designed instrumentation. This software-centric architecture represents a new era in which engineers and scientists can use LabVIEW to tailor open, field-programmable gate array-based hardware for their specific needs.

Over 350 senior mobile industry executives, academics and advisors from 25 countries converged on Cambridge last week to focus on the ‘Reshaping of the Mobile Industry’, driven by the increasing influence of new ‘Over The Top’ web and digital media brands such as Facebook, Google, Skype and Twitter.