Search results for "Panasonic"
Farnell wins prestigious Panasonic Distributor of the Year Award
Farnell, the leading multi-channel distributor of electronic and industrial components, has been named Distributor of the Year by Panasonic. 2010 is the first time Farnell has received the much coveted award from one of the world leaders in electronics technology and innovation.
Panasonic and imec present thin film packaged MEMS resonator with industry record Q factor and low bias voltage
Panasonic and imec present at the International Electron Devices Meeting in San Francisco an innovative SiGe (silicon germanium) thin film packaged SOI-based MEMS resonator featuring an industry-record Q factor combined with a low bias voltage. The high Q factor was achieved by implementing a resonator that operates in a torsional vibration mode, and, by vacuum encapsulation of the resonator in a thin film package. This groundbreaking resonator p...
Low temperature chip bonding from ThreeBond
The TB2217H low temperature cure chip bonder from ThreeBond offers curing at 80°C and addresses an array of chip bonding issues for manufacturers and rework facilities. This single component epoxy offers ease of handling by syringe and full compatibility with automated dispensing systems to enable chip retention on pcb’s going through multi-station lines and wave soldering equipment.
FLIR is officially the most innovative brand
The Plus X Awards is now Europe’s largest contest for technology, sport and lifestyle products. It honours innovative design as the basis of ongoing commercial success by selecting the products that have the best credentials in five categories.
RS boosts medical design with over 500 new products and enhanced website
RS Components today announced a major program to support medical design. It has not only added more than 500 new products to its already substantial portfolio, but also unveiled a dedicated area on its website and embarked on a focussed promotional campaign.
Mouser Delivers Newest Low Cost, Ultra-low Power Wireless Networking Solution from Panasonic
Mouser Electronics, Inc today announced the availability of Panasonic Electronic Components’ Bluetooth RF Modules, PAN1317 and PAN1327.
Low Temperature Cure Surface Mount Adhesive Bonds Micro-Chips In Place at 80°C
The TB2217H low temperature cure chip bonder from ThreeBond offers curing at 80°C and addresses an array of chip bonding issues for manufacturers and rework facilities. This single component epoxy offers ease of handling by syringe and full compatibility with automated dispensing systems to enable chip retention on pcb’s going through multi-station lines and wave soldering equipment.
Count On Tools Offers Custom SMT Nozzles for CREE LEDs
Count On Tools Inc, introduces its new series of custom SMT pick-and-place nozzles for CREE LED components. This new series is manufacturer-approved, based on CREE Inc.’s strict requirements and specifications.
Magma’s Titan Delivers Higher Quality and Faster Design Convergence for Analog IP
Magma Design Automation has announced the availability of a new release of the Titan Analog/Mixed-Signal (Titan AMS) Design Platform. With patent-pending analog design technology, Titan provides an innovative FlexCell-to-GDSII analog/mixed-signal (AMS) flow that organically integrates both electrical design and physical design into one unified design methodology. This paradigm-shifting, electrical-physical co-design flow ranges from front-end des...
Imec announces world-first 300mm-fab compatible directed self-assembly process line
At next week’s SPIE Advanced Lithography conference, imec announces the successful implementation of the world first 300mm fab-compatible Directed Self-Assembly (DSA) process line all-under-one-roof in imec’s 300mm cleanroom fab. The upgrade of an academic lab-scale DSA process flow to a fab-compatible flow was realized in collaboration with the University of Wisconsin, AZ Electronic Materials and Tokyo Electron Ltd. Imec’s DSA collaboratio...