Search results for "6G"

The ultraportable Site Master S331P launched by Anritsu is said to be the lightest, smallest, fastest and most cost-efficient Site Master field cable and antenna analyser ever developed. It addresses the market need for broad frequency coverage and high performance in an extremely compact and economical design.

The MPT3000HVM system has been developed by Advantest to provide a single platform to test the full range of SATA, SAS, and PCIe solid-state drives (SSDs), from the highest performance enterprise to the most cost-effective client SSDs. The system achieves this optimal production test solution by leveraging the proven MPT3000 tester-per-DUT (device under test) architecture and unique hardware acceleration in a new high-density configuration.

A team of embedded experts, Vecow, launched its latest high performance embedded box PC with Intel 6th Generation Skylake platform, ECS-9000 series fanless embedded system.

At European Microwave Week 2016, Aspen Electronics will be exhibiting a wide range of specialist RF and Microwave components as well as test products from some well-known industry brands. Highlights on stand 121 will include products from RN2 Technologies, Custom MMIC and Guerilla RF.

TDK Corporation announces the introduction of the iBH series of 80W, 20A Point of Load (POL) non-isolated DC/DC converters, featuring a wide 0.7V to 5.5V output adjustment range. The iBH converters can operate from either 5V or 12Vdc bus voltages, having a wide input voltage range of 3.5V to 14V, reducing inventory carrying costs by stocking just one part number.

Offering high resolution radar images for designers of military and commercial radar, the AD9164 DAC from Analog Devices helps to reduce solution component count. Additionally, for designers of precision instrumentation equipment, such as smartphone testers, this device ensures improved accuracy as well as speed of test, contributing to faster market-ready time while significantly decreasing tester complexity and size.

A high linearity I/Q demodulator with more than 1GHz, -1dB flatness bandwidth, the LTC5586, has been introduced by Linear Technology. The device supports next-gen 5G wireless infrastructure equipment such as DPD (Digital Predistortion Correction) receivers for base stations, microwave backhaul and Software-Defined Radios (SDR), as well as other broadband receiver applications.

Featuring a very low profile, less than 18mm dependent on choice of heatsink, the tKINO-BW SoC from BVM Ltd is a thin Mini-ITX (170x170mm) format motherboard. The board is graphics intensive, supporting up to three independent displays: HDMI 4k up to 3840x2160 pixels; 18/24-bit dual channel LVDS up to 1920x1200 and VGA up to 1920x1200.

An expansion to its line of MCX interconnects has been introduced by Amphenol RF. Recognised for their small package size and dependable performance, MCX connectors are a popular choice among engineers and application designers.The extended line of PCB jacks are available in straight, right-angle, or edge-mount configurations, with options for surface or through-hole mounting.

Qorvo has announced that its infrastructure solutions have supported more than twenty 5G field trials with global infrastructure providers. This is a key milestone in Qorvo’s strategy to support the evolving 5G ecosystem and help accelerate the deployment of 5G.