Search results for "power supply"

onsemi’s PowerTrench T10 MOSFETs have beenshortlisted for the Electronics Excellence Awardsunder the Power Product category.

Welcome to the shortlist announcement page! Here you will find the amazing, shortlisted products for the most rigorous and transparent award in the industry.

At this year's electronica 2024, Polar Instruments will showcase two test systems for electronics manufacturing and assembly repair, as well as a short circuit locator.

At this month’s IEEE Energy Conversion Congress and Expo (ECCE), Navitas Semiconductor is set to debut its innovative ‘IntelliWeave’ control technique.

Toshiba has launched 2 new products to its electronic fuse (eFuse IC) offering, the TCKE903NL and TCKE905ANA.

Vicor has released three automotive-grade power modules for 48V EV systems, which deliver high power density, and support automotive OEMs and tier-one production in 2025.

Researchers at the Fraunhofer Institute for Photonic Microsystems IPMS have developed a Universal Display Data Converter (UDDC). This enables the transfer of image data to existing Fraunhofer microdisplays from various input interfaces.

Advanced Energy Industries will showcase its latest ultra-efficient power shelves, power supplies, and power converter technologies for enterprise and hyperscale data centres at the Open Compute Project (OCP) Global Summit, held from 15-17 October 2024 at the San Jose McEnery Convention Centre.

The BICKER DC300WS is "Made in Germany" and offers an ultra-wide input range of 6–36VDC and allows flexible choice between 12V, 19V and 24V output voltages. The powerful and fanless DC/DC converter was developed for the stable power supply of the motherboards with the latest generation Intel Core processors. These CPUs have a highly dynamic power consumption with sometimes extreme performance boosts within a very short time. When selecting ...

Navitas has announced GaNSlim, a new generation of highly-integrated GaN power ICs that will further simplify and speed the development of small form factor, high-power-density applications by offering the highest level of integration and thermal performance.