Search results for "chip resistors"
Mouser adds American Bright LED to global linecard
Mouser Electronics has announced a new global distribution agreement with American Bright LED, a supplier of LED components and integrated solutions.
EPI Forum to open doors in Barcelona on October 9-11
The European Processor Initiative (EPI), a project with 27 partners from 10 European countries, with the goal of helping to achieve EU independence in HPC chip technologies and HPC infrastructure has announced the first EPI Forum to be held in Barcelona, Spain, October 9-10, 2024.
What it means to be the inventor of the IGBT
Following his achievement of the 2024 Millennium Technology Prize, Electronic Specifier recently spoke with the inventor of the IGBT, Professor Bantval Jayant Baliga, on what it means to him and what he hopes to see in the future.
Silicon Labs introduces Bluetooth channel sounding
On 4th September 2024,Silicon Labsannounced support forBluetooth Channel Soundingtechnology on its xG24 platform, marking a significant step forward in Bluetooth Low Energy (LE) ranging capabilities.
IDS: Wired with micrometre precision
Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometres are used to create tinyelectrical connectionsbetween a semiconductor chip and other components.
SEMICON India will explore smart manufacturing and more
SEMICON India 2024, set to take place from 11-13 September in Greater Noida, Delhi NCR, will bring together global leaders, semiconductor experts, academia, and government representatives.
Siemens' software adopted to streamline SoC development
Siemens Digital Industries Software has announced that SiliconAuto has adopted its PAVE360 software to streamline the development of its advanced semiconductors for the automotive sector.
Murray Percival expands demonstration room
The Murray Percival Company is pleased to announce the addition of four cutting-edge pieces of equipment to its demonstration facility.
CoreHW and Presto Engineering develop ultra-small low-power RF module
CoreHW and Presto Engineering have announced the successful development of the first enhancedlow-power radio frequency(RF) 2.4GHz front-end module, packaged in an ultra-small and thin wafer-scale form.
En route towards the first German quantum computer
In collaboration with 24 German research institutions and companies, coordinated by Forschungszentrum (FZ) Jülich, Fraunhofer IPMS is contributing to the development of an integratedGerman quantum computerbased on superconducting quantum chips with enhanced error rates.