Search results for "SEMI MEMS"
SEMI Energy Collaborative: recommendations to boost low carbon energy in South Korea
In an effort to help the global semiconductor value chain lower greenhouse gas (GHG) emissions,the industry association SEMIreleased its first region-specific analysis of current and forecasted low-carbon energy (LCE) markets for South Korea.
Semi-Kinetics installs 3D inspection systems
Semi-Kinetics is pleased to announce the installation of three Koh Young 3D Automated Optical Inspection (AOI) systems at its California facility.
TMOS-based infrared sensor opens up new applications
The STHS34PF80 sensor from STMicroelectronics is an uncooled, factory-calibrated, infrared motion and presence detection sensor with operating wavelength between 5µm and 20µm.
Top 5 sensor products in January
Electronic Specifier takes a look at the top 5 sensor products to have been released in January 2024.
TRI to display new wafer inspection and metrology solution
Test Research, Inc. (TRI), a provider of test and inspection systems for the electronics manufacturing industry, will be participating inSEMICONTaiwan at the Taipei Nangang Exhibition Centre, Hall 1 – 4F, from 4-6th September 2024.
SEMI and Policy Equity Group fund initiative for semiconductor child care gaps
Seeking to bolster the semiconductor industry workforce in the US by addressing gaps in child care needs, the SEMI Foundation and Policy Equity Group have announced a collaboration to help companies comply withchild care requirementsunder the US CHIPS and Science Act.
Swissbit hosts EuroPAT Workshop 2024
The EuroPAT Workshop 2024 is to be hosted by Swissbit, September 9th-10th, in Berlin, Germany, under the SEMI Europe umbrella.
Alphawave appoints Sameer Ladiwala
Alphawave Semi has announced the appointment of Sameer Ladiwala as SVP Finance & Chief Accounting Officer (CAO).
Posifa adds capacity to support sensor market growth
Posifa Technologies is expanding its assembly and test capacity near Shenzhen, China to support its move into the market for A2L refrigerant and hydrogen sensors.
Alphawave Semi launches 3nm UCIe IP with TSMC CoWoS packaging
Alphawave Semi has launched the industry's first 3nm successful silicon bring-up of Universal Chiplet Interconnect Express (UCIe) Die-to-Die (D2D) IP with TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) advanced packaging technology.