Search results for "Nordson"
Nordson DAGE opens in Korea
X-ray inspection and bondtesting specialist Nordson DAGE has opened an Asian clean room demonstration facility south of Seoul, Republic of Korea. It is a 102 m2clean room and conferencing center providing all of regional customers with access to Nordson DAGE’s 4800 advanced automated wafer-level bondtester and XM8000 automatic wafer x-ray metrology tool.
Plasma System Increases Machine Capacity
Nordson MARCH has introduced its ModVIA plasma system, a fully integrated, flexible system that doubles its capacity from 4 to 8 cells (8-16 panels) to easily accommodate manufacturing production growth. The ModVIA's compact design and small footprint save valuable floor space while delivering the same time-tested results and proven technology to treat printed circuit boards for desmear, etchback, and to provide surface activation, like other sys...
Nordson ASYMTEK at SMT Hybrid Packaging
Nordson ASYMTEK is to present a triple-valve, closed-loop system to jet conformal coating, a UV oven to cure it, and an automated coating inspection system to verify the coating results in the SmartTec stand at SMT Hybrid Packaging.
Nordson at SMT/Hybrid/Packaging 2016
Nordson DAGE, MatriX Technologies and Nordson YESTECH, divisions of Nordson Corp will exhibit their Test and Inspection systems at SMT/Hybrid/Packaging in Nuremberg. Nordson DAGE makes bond testing equipment and will be showcasing the second generation 4000Plus with camera assist automation which is ideally suited for applications such as pull and shear testing of wafer interconnections, lead frames, hybrid microcircuits or automotive electronic ...
Inovar increases its defect detection rate
EMS provider Inovar has purchased and installed an XD7600NT Ruby X-rayInspection System with X-Plane technology from Nordson DAGE. The companywill use the system for internal troubleshooting and failure analysis activities.
Nordson DIMA to showcase hot bar soldering at IPC APEX
Nordson DIMA will demonstrate its hot bar soldering and heat seal bonding equipment at IPC APEX EXPO 2016, in the booth of sister company, Nordson ASYMTEK.Show visitors can learn best practices in hot bar soldering and heat seal bonding processes and find solutions to their challenging assembly applications, like flex-to-flex, flex-to-PCB, and wire-to-PCB assembly, as well as rework.
Computrol increases its X-ray Inspection capability
Computrol has purchased an XD7600NT Ruby X-ray from Nordson DAGE and the system has already been installed at Computrol’s Meridian, ID facility. The Nordson DAGE NT maintenance-free, sealed-transmissive X-ray tube, providing0.5µm feature recognition and up to 10W of power, together with the 2Mpixel XiDAT3 digital image intensifier covers all the failure analysis and manufacturing tasks required in the production environment.
Dispensing and conformal coating systems and software at IPC APEX 2016
Nordson ASYMTEK will introduce its new generation of conformal coating, fluid dispensing, jetting, software, and hot bar soldering systems, capabilities, and applications at IPC APEX 2016. The systems deliver precision, flexibility, reliability, high throughput, ease-of-cleaning, and intuitive programming and operation with a low cost-of-ownership.
White Paper evaluates the effects of RF Plasma Processing Prior to Conformal Coating
Nordson MARCHhas recently released a white paper showing the results of RF plasma processing on conformal coating adhesion, the conformity of the coating coverage, and the resulting effects on electrical functionality of a fully assembled printed circuit board. The research was done in conjunction with Nordson ASYMTEK, AirBorn Electronics, and SMART Microsystems (formerly known as Desich SMART Center).
Nordson YESTECH to show advanced 3D Technology for AOI at APEX 2016
Nordson YESTECH has announced that it will launch its latest innovation in 3D inspection at the IPC APEX EXPO. The new FX-940 ULTRA 3D AOI incorporates cutting-edge 3D technology for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips, BGA’s and other height sensitive devices.