Search results for "Master Bond"
Mitigating supply chain obsolescence: exploring the semiconductor manufacturing puzzle
There are many pieces to any semiconductor product ‘puzzle’ that can result in obsolescence. These pieces range from business revenue to any one of the subcomponents that compose semiconductor products, such as foundry process technologies, packages, substrate or lead frames, test platforms, or design resources.
Facing challenges and anticipating the future of robotics
Comau is a global technology company that specialises in bringing the benefits of digital-driven advanced automation within a wide range of traditional and emerging markets, including those characterised by unstructured environments.
Diagnostics tester and test adapter for AC charging points
Launching PROFITEST H+E EXPERT CHECK, Gossen Metrawatt introduces a robust diagnostic tester corresponding to measurement category CAT III 300V for standard-compliant functional testing of AC charging stations in accordance with DIN EN/IEC 61851-1 (VDE 0122-1).
MYIR unveils $55 Remi Pi computer board
MYIR has launched the Remi Pi, a unique and compact computer board that offers an affordable solution based on the Renesas RZ/G2L MPU, which takes into account the needs of serious product development and hobbyist creativity.
Bridging tracks and tech with embedded computing
Modern railways are seeing enhanced efficiency, safety, and overall performance of daily operations thanks to the continuous advancements in technology. At the heart of its ongoing progression is the use of embedded PCs.
Heraeus Electronics hosts ALL2GaN event
Heraeus Electronics is proud to announce that it will host an upcoming ALL2GaN event from April 9-10, 2024, at its facilities in Hanau.
IO-Link device transceiver with low residual voltage and integrated surge protection
The TIOL112(x) family of transceivers implements the IO-Link interface for industrial bidirectional, point-to-point communication. When the device is connected to an IO-Link master through a three-wire interface, the master initiates communication and exchange data with the remote node while the TIOL112(x) acts as a complete physical layer for the communication.
ARIA: The generative AI-powered virtual building assistant
BrainBox AI,a pioneer in building technology, has announced the launch of the first virtual building assistant,ARIA(Artificial Responsive Intelligent Assistant).
Melexis’ new approach to dynamic RGB-LED application development
Melexis unveils the ADK81116 application development kit. Designed to simplify the development of dynamic RGB-LED automotive applications, this solution comes with pre-loaded configurable firmware.
Ventec to launch new bondply dielectrics and value-added services
Ventec International Group has announced its plans to unveil new products aimed at enhancing signal integrity and thermal performance, alongside introducing new services at the IPC APEX Expo 2024, scheduled for 9-11thApril at booth #4309.