Search results for "tactical communications"
800G OSFP transceiver enters volume production
LESSENGERS, a supplier of optical components based on its patented “direct optical wiring” (DOW) technology, says its new 800G transceiver product (800G OSFP SR8) will begin volume production in the Q4 2023, followed by shipping to customers.
Keysight, Synopsys, and Ansys accelerate RFIC semiconductor design
Keysight Technologies, Synopsys, and Ansys announced a new reference flow for the TSMC N4PRF, the semiconductor foundry’s advanced 4 nanometer (nm) radio frequency (RF) FinFET process technology.
Top 5 communications products in September
Electronic Specifier takes a look at the top 5 communications products to have been released in September 2023.
Savox Communications launches wireless intercom system
Savox Communications, the provider of mission critical hearing protection and communication solutions, is launching an intercom system which will bring a situational Sixth Sense into team operations: the Savox IMPW.
UK launches £65 million funding call for space technologies and applications
The UK Space Agency has announced up to £65 million of funding for ground-breaking innovations that could boost UK leadership in space technologies and applications.
Jinglei Ritzerfeld-Liu honoured at Molex’s Annual Distributor awards
TTI – Europe, a specialty distributor of electronic components, is celebrating its Senior Manager of Strategic Product Marketing – Jinglei Ritzerfeld-Liu – as the winner of the ‘2023 Most Valuable Performer’ award at Molex’s Distributor of the Year awards ceremony.
Processing power boost enhances microcontrollers
Distributor Mouser Electronics is now shipping the MOTIX TLE989x microcontrollers (MCUs) from Infineon Technologies.
G+D and Sony launch remote SIM provisioning of iSIMs
The integrated SIM (iSIM) is an important evolutionary step in SIM technology, empowering simple and cost-efficient connection, deployment, and go-to-market for Internet of Things (IoT) devices.
Molex introduces MX60 Series of contactless connectivity solutions
Molex, a global electronics and connectivity innovator, has diversified its product portfolio with the introduction of the MX60 series of contactless connectivity solutions.
Microchip introduces first low pin count MCU family with I3C support
With the step-function increase in data collected and transmitted from cloud-connected edge nodes, Improved Inter Integrated Circuit (I3C) is rapidly becoming a more sustainable solution for interfacing sensors with a high data rate and will help expand capabilities in next-generation devices.