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Expanding its effort to bring wireless power capabilities to the market, Texas Instruments has today announced plans to develop multi-mode wireless power integrated circuits for smartphones and other portable electronics. TI will continue to develop new bqTESLA wireless power receiver and transmitter integrated circuits that comply with existing and future versions of the Wireless Power Consortium Qi standard.

RF Micro Devices announce the expansion of the Company's entry solutions product portfolio to include multiple new solutions for 2G and 3G entry smartphones. The new RF solutions are designed to solve the increasingly complex RF requirements of entry-level 2G and 3G smartphones related to cost, band count, and thermal dissipation.

Spending on research and development by semiconductor companies grew 7% in 2012 to a record-high $53.0 billion, even though the semiconductor market declined 1% to $317.6 billion, according to the 2013 edition of IC Insights’ McClean Report. The increase lifted R&D spending by chip companies to 16.7% of total semiconductor sales in 2012, the highest level since the peak of 17.5% was reached in both 2008 and 2009.

Broadcom today announced that its HomePlug AV Powerline Communications solution has been selected by NETGEAR. Now shipping, NETGEAR's new line of 200Mbps Powerline Adapters are powered by Broadcom's BCM60321 HPAV PLC system-on-a-chip.

The 2013 International CEA will unveil the latest wireless technologies and trends across the mobile connected universe, including advancements in accessories, the cloud, e-books, embedded technology, smartphones and tablets, through a series of keynote addresses, supersessions, conference tracks and TechZones dedicated to future trends in wireless technology. Owned and produced by the Consumer Electronics Association, the 2013 CES, the world’s...

Texas Instruments today announced it has joined the Alliance for Wireless Power. TI will continue to develop new bqTESLA wireless power receiver and transmitter integrated circuits that comply with existing and future versions of the Wireless Power Consortium Qi standard, and also create products that support the A4WP magnetic resonance specification.

Denny Steele, Director of Strategic Business Marketing for Lattice Semiconductor investigates, in this ES Design magazine article, how the latest low power FPGAs are bringing an extra level of flexibility to smartphone design.

A forecasted ranking and discussion of the 2012 top semiconductor suppliers will be included as part of IC Insights' upcoming November Update to The McClean Report. Also included in the November Update will be a listing of the top semiconductor industry capital spenders and a description of a “new” IC industry cycle model.

Integrated Device Technology and Qualcomm have today announced a collaboration to enable IDT’s development of an integrated circuit for consumer electronics devices based on Qualcomm’s WiPower Technology. This IC will be designed to meet the requirements of Qualcomm’s new near-field magnetic resonance wireless power charging solution that is designed to provide spatial freedom for charging consumer electronics, such as mobile phones and oth...

Qualcomm and Oracle, today announced they are working together to bring Oracle Java ME Embedded 3.2 support to QTI’s QSC6270-Turbo chipset, which utilizes QTI’s industry leading Gobi modem solution for 3G. This collaboration will help accelerate the development and deployment of Machine-to-Machine applications with embedded cellular connectivity.