Search results for "advanced engineering"
Microchhip launches products for wireless connectivity
With the advent of Industry 4.0, the rapid growth of AI, digital manufacturing, and the IoT, the need for reliable wireless connectivity in commercial and industrial settings is expanding at a remarkable rate.
Bota Systems’ new sensor optimises Cobots for heavy payloads
Bota Systems, a pioneer in multi-axis force-torque sensors, has launched the SensONE T80, specifically designed for larger cobots. Featuring ISO-standard flanges on both sides, the sensor simplifies integration and ensures superior accuracy even with heavier payloads.
PIC Summit stresses aiding photon chip growth
More than 700 key figures from the semiconductor and photonic chip sectors have gathered in Eindhoven for one of the largest summits of its kind to discuss the industry's future.
onsemi exhibits at electronica
At this year's electronica, attendees can explore a wide range of onsemi's intelligent power and sensing technologies that address the world's toughest problems, helping to pave the way for a safer, more sustainable, and technologically advanced future.
SSDL awarded NATO AWACS contract
Solid State Disks Limited (SSDL) has been awarded a contract to supply the NATO Airborne Early Warning & Control Force (NAEW&CF), based in Geilenkirchen, Germany, with 40 solid-state data storage drives for use in Airborne Warning and Control Systems (AWACS) aircraft.
Rohde & Schwarz demonstrated wireless power system
At the IEEE Wireless Power Technology Conference and Expo (WPTCE) in Kyoto, Japan, Rohde & Schwarz presented a proof of concept for testing far-field wireless power systems.
Google goes nuclear to power AI data centres
Google has announced a partnership with Kairos Energy as it turns to nuclear energy to tackle the growing AI data centre power consumption crisis. The partnership will see Google utilise a fleet of Kairos Energy’s advanced small nuclear reactors for its AI data centres, potentially the start of an industry-wide sweep to decarbonise the tech sectors carbon footprint.
Indium will participate in IEMT
Indium Corporation is pleased to announce its participation in the upcoming International Electronics Manufacturing Technology Conference (IEMT), to be held from 16-18 October in Penang, Malaysia.
Bransys expands manufacturing capabilities
Bransys Group is pleased to announce the expansion of its manufacturing capabilities with the acquisition of two REHM VisionXP+ Nitro 3850 Type 834 reflow ovens.
Cloud-enabled logic modules are space savers
In stock at authorised distributor Mouser Electronics are the new LOGO! 8.4 logic modules from Siemens.