Search results for "Toshiba"
600V driver IC enables square-wave speed BLDC motor control
Toshiba Electronics Europe has expanded its line up of High Voltage Intelligent Power Devices (HV-IPD) with the addition of a motor driver IC in a compact surface mount package that is rated to 600V. The TPD4152F enables a square-wave speed control of small BLDC electric motors. It is aimed at applications including air conditioners, air purifiers, fans, ventilators and water heaters.
Flexible licensing & support models speed time-to-market
Imagination Technologies announces that it is offering complete Ensigma connectivity IP system solutions including WiFi/Bluetooth software, Media Access Control (MAC) layer, baseband, AFE and RF, through a range of flexible licensing and support models.
Low-power MCUs support high-speed IoT/M2M operation
Toshiba has announcedthe TXZ familyof ARMCortex-based MCUs, supporting low-power consumption and high-speed operation for IoT and M2M ecosystems.The TXZ family has been designed to meet market needs for low power consumption systems by integrating the ultra-low power design technologies adopted in Toshiba’s TZ series of ApP Lite application processor family for IoT solutions into current TX family of MCUs.
BSI CMOS image sensors are equipped with PDAF
Toshiba has expanded its range of high performance BackSide Illumination (BSI) CMOS image sensors equipped with Phase Detection Auto-Focus (PDAF). Designed for use in smartphones and tablets, the sensors achieve high performance image capture and low power consumption. The range expansion features the 8MP T4KA3-121, the 16MP T4KC3-121, the 13MP T4KB3-121 and the 20MP T4KA7-121.
Wireless power receiver IC matches wired charging speeds
Toshiba has launched a wireless power receiver IC that will enable mobile devices to be charged wirelessly, as fast as if they were connected to the charger via a cable. The TC7764WBG supports a maximum power output of 5W and is compliant with the Qi standard’s low power specification V.1.1.2, defined by the Wireless Power Consortium (WPC).
First ever dual-fuel hydrogen-diesel conversion of refuse trucks
ULEMCo is on target to complete the dual fuel conversions of the Refuse Collection Vehicles (RCVs) and associated vans, under the recently announced Levenmouth Community Energy Project. The RCV conversions, which are believed to be the first of their type in the world, will be used by Fife Council as key partners in the project, to perform normal refuse collection duties, and extend the practical use of hydrogen as an alternative transport fuel.
NVMe PCIe SSD families cut latency & up performance
Toshiba has announced three SSD families fitted with high-speed PCIe interfaces that provide high-bandwidth point-to-point links with the processor and reduce system bottlenecks. The drives use the NVMe (Non-Volatile Memory Express) protocol and have been designed for various applications including high performance, thin and 2-in-1/convertible notebooks, all-in-one PCs and tablets and server/storage applications.
Toshiba licences ARM Cortex-A53 processor for ASSP development
Toshiba has licensed the ARMCortex-A53 processor, for deployment developing Application Specific Standard Products (ASSPs), such as ApP Liteapplication processors that offer well balanced power-efficiency and performance with 64-bit capability, and custom products such asFit Fast Structured Array (FFSA) and Application Specific Integrated Circuit (ASIC) for industrial, networking, IoT, automotive and data storage products.
World's first 16-die stacked NAND flash using TSV
Toshiba has announced the development of the world’s first16-die (max.) stacked NAND flash memory utilising Through Silicon Via (TSV) technology.The prior art of stacked NAND flash memories are connected together with wire bonding in a package. TSV technology instead utilises the vertical electrodes and vias to pass through the silicon dies for the connection.
'World's first' 256Gb, 48-layer 3D stacked flash BiCS device
Toshiba has launched its latest generation of Bit Cost Scalable (BiCS) FLASH, a 3D stacked cell structure flash memory. Toshiba hails the device as the ‘world’s first’ 256Gb, 48-layer BiCS device, deploying industry-leading 3-bit-per-cell Triple-Level Cell (TLC) technology.BiCS FLASH is based on a leading-edge 48-layer stacking process that surpasses the capacity of mainstream two dimensional NAND Flash memory while enhancing wr...