Search results for "SEMICON Europa"

The Nordic nRF5340 Audio Development Kit contains three primary devices: The nRF5340 SoC, the nPM1100 PMIC, and Cirrus Logic’s CS47L63 Audio DSP. It is typically powered via USB and has a battery connector for a Li-Ion/Li-Po battery. The Power Profiler Kit II uses the dedicated current measurement pins to allow current consumption measurement.

iWave has announced the launch of the iW-RainboW-G61M System on Module, powered by NXP Semiconductors i.MX 95 applications processor.

Lauterbach’s TRACE32 development tools now support NXP Semiconductors’ S32N55 vehicle super-integration processor for consolidation of real-time vehicle functions in software-defined vehicle (SDV) architectures. TRACE32 tools support includes simultaneous debugging of the processor cores as well as non-intrusive processor trace capture.

Honda has announced that it and IBM have signed a Memorandum of Understanding (MoU) outlining their intent to collaborate on the long-term joint research and development of next-generation computing technologies needed to overcome challenges related to processing capability, power consumption, and design complexity for the realisation of the software-defined vehicles (SDV) of the future.

During this year’s PCIM Europe in Nuremberg, Germany, June 11th – 13th, ROHM will present its new power semiconductor solutions with a special focus on wide bandgap devices.

Here, you can find out the key factors to consider when implementing GaN in power electronics design processing, and the challenges of doing so.

The 35th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2024) opens with a focus on critical topics ranging from yield management and metrology to new developments in AI, smart manufacturing, and sustainability.

A new agreement between Nordic Semiconductor and patent pool administrator Sisvel for the licensing of standard essential patents (SEPs) reading on LTE-M and NB-IoT cellular technology has been announced.

Fan out wafer level packaging (FOWLP) is an advanced semiconductor technology designed to enhance performance and miniaturise electronic devices.

In high-performance applications, the shift from silicon (Si) to silicon carbide (SiC) and gallium nitride (GaN) power semiconductors is significant. However, testing and qualifying these wide-bandgap semiconductors pose new challenges.