Search results for "SEMI MEMS"
Implementing GaN in power electronics design: key factors
Here, you can find out the key factors to consider when implementing GaN in power electronics design processing, and the challenges of doing so.
Nordic and Sisvel to streamline cellular IoT SEP licensing
A new agreement between Nordic Semiconductor and patent pool administrator Sisvel for the licensing of standard essential patents (SEPs) reading on LTE-M and NB-IoT cellular technology has been announced.
What is fan out wafer level packaging?
Fan out wafer level packaging (FOWLP) is an advanced semiconductor technology designed to enhance performance and miniaturise electronic devices.
Dynamic test methods tailored to specific applications
In high-performance applications, the shift from silicon (Si) to silicon carbide (SiC) and gallium nitride (GaN) power semiconductors is significant. However, testing and qualifying these wide-bandgap semiconductors pose new challenges.
Indium experts will present at Electronics in Harsh Environments Conference
Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East at Indium Corporation, will deliver a technical presentation, while Dr. Ronald Lasky, Senior Technologist, will lead both a workshop and a technical presentation at the Electronics in Harsh Environments SMTA Conference from May 14 to 16 in Copenhagen, Denmark.
Ruland offers new bellows and disc couplings
Ruland is now offering bellows and double disc couplings with bore sizes extending up to 45 mm or 1-3/4 in, catering to systems with torque requirements of up to 158 Nm (1,4000 in-lbs).
UK joins EU supercomputing scheme and opens researcher funding
British researchers, businesses, and academics will have enhanced access to future supercomputer research funding from 13th May 2024 as the UK joins the European High Performance Computing Joint Undertaking (EuroHPC).
DELO offers a new adhesive for closed-cavity packaging
DELO has developed a new, reliable sealant adhesive for CMOS image sensors, which are often used in driver monitoring systems.
Indium Corporation to present at PCIM Europe
Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, June 11-13, in Nuremberg, Germany.
Printed electronics in electrified and autonomous mobility
Electrification, autonomy, and vehicle ownership saturation are causing a technological revolution in the automotive sector.