Search results for "RF design"

Photonic chip industry accelerator PhotonDelta is launching a global engineering contest in collaboration with Wevolver, the global knowledge and community platform for engineers, to stimulate the creation of new applications for photonic chips that tackle global challenges.

MediaTek has introduced the Dimensity 9400, its latest smartphone chipset, designed specifically for optimisingEdge-AI applications. Managing Editor Paige West attended a press talk to learn more.

Paige West speaks with Robert King, Reed Relay Product Manager, Pickering Electronics about how semiconductor test canbenefit from reed relays.

SEGGER has announced the integration of Microsoft exFAT support into its emFile system, a fail-safe file system designed for embedded applications. With this enhancement, emFile is now capable of supporting volumes formatted with either FAT or exFAT, allowing it to efficiently handle files of virtually any size. emFile’s design is tailored for embedded systems, offering optimized memory usage in both RAM and ROM, high-speed performance, and...

Omron Electronic Components Europe has introduced the G7EB-E2 high-power PCB relay, an advanced version of the G7EB series.

Traditionally, developing software for digital signal processors (DSPs) has been a complex, multi-step process.

Silicon Labs, a pioneer in secure, intelligent wireless technology for a more connected world, delivered the opening keynote for the inaugural embedded world North America, with CEO Matt Johnson and CTO Daniel Cooley discussing how AI is driving a revolution in IoT, while detailing the continued success of the company’s growing Series 2 platform and upcoming Series 3 platform.

The hyperspectral camera ASPECT, developed by VTT, is on board the European Space Agency’s (ESA) space mission, Hera, to test the deflection technology of potentially hazardous asteroids.

E.E.P.D., solution partner for customised and standard embedded computer boards and systems based on x86 and ARM, together with Pyramid North America will present the latest single board computers (SBC) and systems at embedded world North America 2024, booth #2623.

The TDA4VH-Q1 TDA4AH-Q1 TDA4VP-Q1 TDA4AP-Q1 processor family is based on the evolutionary Jacinto™ 7 architecture, targeted at ADAS and Autonomous Vehicle (AV) applications and built on extensive market knowledge accumulated over a decade of TI’s leadership in the ADAS processor market.