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Swissbit to showcase secure data retention at GPEC 2024
For the first time, Swissbit will be present at the General Police Equipment Exhibition & Conference (GPEC) scheduled from 6-8 May 2024 in Leipzig, Germany.
Semiconductors of the future using cutting edge transistors
The significance of transistors capable of altering their properties cannot be understated in the advancement of future semiconductors.
ETL-rated hazardous location position sensors
Major chemical companies are using hazardous location position sensors from NewTek Sensor Solutions to monitor the state of different valves throughout their plants as part of process safety and efficiency management.
Customers can switch-on to innovation at Farnell
Farnell now offers a collection of premium PCB mount switches from suppliers in the industry. This range features a variety of switch types, including micro, rocker, push button, toggle, rotary, SIP/DIP, joystick switches, and beyond. Each switch is carefully selected to adhere to the utmost quality standards.
Drone innovators win £500,000 to improve UK medical supply chain
£500,000 has been allocated to support five projects within the health sector that utilise drones for the delivery of medicines and medical supplies.
ESA’s Proba-3 ready to launch at the end of the year
The European Space Agency’s (ESA) Proba-3 mission has been announced to be ready to launch by the end of the year.
Game-changing solutions at Ceramics Expo
No matter where you sit on the advanced manufacturing supply chain, discover game-changing solutions at Ceramics Expo.
Nexeon breaks ground on first silicon anode material production site
Nexeon marked a significant advancement with the commencement of construction on its inaugural commercial production plant.
Greenliant to show new eMMC and NVMe NANDrive BGA SSDs
Greenliant will showcase its latest high endurance EX Series and cost-effective PX/VX Series NVMe and eMMC NANDrive ball grid array (BGA) solid state drives (SSDs) at embedded world 2024, held in Nuremberg, Germany, from 9-11 April, located in hall 4A, booth 606.
Indium Corporation’s Sze Pei Lim at ICEP Japan
Indium Corporation’s Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim, is scheduled to present at the International Conference on Electronics Packaging (ICEP Japan 2024).