Search results for "LASER COMPONENTS"
EU Cyber Resilience Act: what embedded developers must know
If you CE-mark your products you need to understandthe Cyber Resilience Act(CRA), a new EU law.
TI releases its new MagPack technology for power modules
Texas Instruments (TI) has launched six new MagPack power modules designed to improve power density, enhance efficiency, and reduce EMI.
NEC technology reliably measures sea levels from distance
NEC has developed a technology for measuring sea levels with high accuracy from greater distances using 3D LiDAR, a remote sensing technology.
STMicroelectronics new single-zone direct-ToF sensor
STMicroelectronics has introduced the VL53L4ED single-zone Time-of-Flight (ToF)sensor, which has an extended operating temperature range from –40°C to 105°C.
Open Innovation AI and Nscale to deploy 30,000 AI GPUs
Open Innovation AI and Nscale have announced a strategic partnership to deliver AI Cloud services and optimised AI workloads at scale globally.
High power PCB relay for compact EV wall chargers
Omron has launched a new high power PCB relay for use in AC wallboxes for Mode 3 AC EV charging stations.
MYIR launches new SOM based on Rockchip RK3568 processor
MYIR has launched the MYC-LR3568, a cost-effective System-on-Module (SoM) that is powered by the high-performance, low-power quad-core ARM Cortex-A55 processor RK3568 from Rockchip.
Adeia wins ECTC Award for “Fine Pitch Die-to-Wafer Hybrid Bonding” paper
Adeia was awarded Best Session Paper at the 2024 Electronic Components and Technology Conference (ECTC) held in Denver, Colorado on May 28-31, 2024. Find more industry awards, here.
Epoxy meets NASA low outgassing specifications
Master Bond Supreme 11AOHTLP is atwo component epoxyfeaturing thermal conductivity and electrical insulation.
Who owns Future Electronics?
Future Electronics, a global pioneer in electronic components distribution, was acquired by WT Microelectronics, a Taiwan-based semiconductor components distributor, in 2023.