Search results for "ASIC"

Sundanceannounced the launch of its high-performanceaccelerator card based on the Xilinx XCVU190-2FLGC2104E FPGA. As an option the boardcan be fitted with lower cost FPGAs in the family, namely XCVU095, XCVU125, and XCVU160.This board is designed for superior data throughput leveraging various industry-standardinterfaces, including 8 lanes of PCIe Gen 3, PCIe104 expansion connectors, and CFP4 opticalnetworking.

Linear introduces theLTM4643quad output step-down µModule(power module) regulator, configurable as a single output (12A), dual (6 & 6A or 9 & 3A), or quad (3A each) regulator in a 9x15x1.82mm ultrathin LGA package. This flexibility enables system designers to rely on one simple and compact µModule regulator for a variety of voltage and load current requirements in FPGA, GPU, ASIC and processor-based applications.

Thermopile sensor arrays can solve smart buildings’ challenges without compromising privacy, writes Sally Ward-Foxton. Image left:Melexis’ 32x24 pixel thermopile array, plus its optics, fits into a 4-pin TO-39 can

During the 5thMicroTCA Workshop for industry and research taking place at DESY in Hamburg, Germany on 7th-8thDecember,VadaTech, together with integration partner Emcomo Solutions, will present innovations in MicroTCA. The workshop provides an opportunity to showcase MicroTCA and MicroTCA.4 technology and to hear about applications across the worldwide research community.

Broadcom announced shipments of its latest series of heterogeneous knowledge-based processors (KBPs), the BCM15000 (BCM15K), designed for modern network infrastructure including core, edge and data center routers and switches. The BCM15K is a new series of 16nm KBPs which integrates TCAM, SRAM and algorithmic search technology to enable unprecedented levels of forwarding, classification and security for service provider routers and switches.

Following the announcement of its parent company in the acquisition of Sicomm Technologies, a leading Chinese ASIC design house, CML Microcircuits is set to expand its Digital Mobile Radio (DMR) market penetration.

At electronica 2016, SWINDON Silicon Systems will show how its expertise in mixed signal ASIC/MEMS and System on Chip (SoC) technology will benefit the industry’s move towards intelligent sensing. Specialists from the SWINDON engineering team will be on hand to discuss how their custom-designed SoCs can transform raw data into valuable information.

EM Microelectronic has announced the EM9304, a tiny, low-power, SoC optimised for Bluetooth v4.2 Low Energy-enabled IoT, wearable and smart electronics products. The EM9304 is architected for flexible usage in a variety of BLE applications. For simple applications such as beacons or smart sensing wearables, the EM9304 can be used standalone, or connected to a variety of sensors with standard serial interfaces.

EM Microelectronic, the semiconductor company of the Swatch Group, announces the EM9304, a tiny, low-power, SoC optimised for Bluetooth v4.2 low energy enabled IoT, wearable and smart electronics products.The EM9304 is architected for flexible usage in a variety of Bluetooth low energy (BLE) applications. For simple applications such as beacons or smart sensing wearables, the EM9304 can be used standalone, or connected to a variety of sensors wit...

TrenzElectronic’s FPGA System on Modules (SoMs) are currently available from Digi-Key Electronics, as part of a new global distribution agreement signed by the two companies.TrenzElectronic uses the latest technologies and components from top semiconductor companies to make the smallest form factor modules. In the event that an off-the shelf FPGA board will not fit the customer’s requirements, the design can be easily adapted by their...