Search results for "electronica"

Molexis meeting the increased demand for in-vehicle processing power. Top tier automakers are facing new challenges as they strive to build next-generation, intelligent vehicles. They require agile connectivity solutions with seamless end-to-end network integration across hardware, software and services.

Hyster H2.0-3.5FT ICE lift trucks are now available with added value features incorporated as standard to deliver all-round benefits to demanding operations throughout the supply chain. Here,Matthew Allen, Product Manager for Hyster Europe, shares his pick of ten of the truck’s features and options which are providing 360° benefits in industry applications for 2019, and beyond.

At its booth TE is demonstrating its range of terminals, connectors, antennas, relays and sensors to address these challenges in a Tech Talk programme that will incorporate 25 presentations over three days. It will also show several new products and technology highlights in a series of exhibits and demos.

The future of its automotive and high-efficiency power and sensing technologies are demonstrated by Allegro MicroSystems at electronica 2018.Allegro MicroSystems in Hall C5 stand 232 is showcasing a variety of intelligent solutions at electronica Munich that give automotive and industrial manufacturers a competitive edge – these solutions include a new coreless current sensor IC.

Fischer Connectors continues to push the boundaries in rugged miniaturisation, high speed data transmission, sealing, wearability and IoT. At the biennial tradeshow electronica, the company showcases in Hall B2, Stand 219 how it is reimagining connectivity with its customers thanks to technological partnerships with Wearable Technologies and SolarStratos, as well as cross-market customer applications in the medical, security, industrial, unmanned...

Exaganis extending its market reach by introducing newG-FETpower transistors and G-DRIVE intelligent, fast-switching devices with enhanced power capabilities for automotive and server applications. With the products’ drain-source on resistance (RDSon) capabilities ranging from 30-65mΩ, these new releases provide enhanced performance and power efficiency for diverse applications including Electric Vehicles (EV), industrial equipment an...

At this year's electronica trade show taking place from the 13th to 16th November, MesseMünchen,HUBER+SUHNERis set to present a new era for critical connectivity.Designed for phase critical applications requiring ultimate precision and reliability, the company’s new product line of Consistent Over Temperature (CT) phase invariant cable assemblies provide performance across a number of key factors.

ZF Switches and Sensors have developed a very efficient modular approach to speed and direction sensing. The hall-effect sensor’s modular design allows customers to pre-select key sensor criteria including shaft length and output interface.Supplied with a plastic housing and mounting flange all standard parts meet the requirements of IP67, and notably IP69 for harsh environmental conditions with ingress protection at depths of 20-60mm.

The inaugural ‘electronica Experience’ at this year’s show in Munich (November 13-16) will see RS Components (RS) playing a prominent role. Taking place in the brand new Hall C6, the electronica Experience aims to deliver advice and a first-hand technology experience to young people to help inspire them to pursue a career in engineering.

The motto of this year’s electronica (November 13th to 16th, 2018) is ‘Connecting everything—safe, smart, safe, and secure’. The new format in hall 6 is centred around giving exhibitors, school pupils, students, and specialist visitors the opportunity to network.