Search results for "automation"
What’s next for electronics manufacturing
Critical Manufacturing is thrilled to announce its participation in productronica 2023, the premier event for electronics production.
Conference highlights Asia's semiconductor industry growth
Following the success of its inaugural edition, the second Electronics Asia Conference (EAC), a virtual conference and exhibition organised byAspenCore, the publisher of EE Times Asia, EE Times India, and EDN Asia, is set to take place from October 17 to 19, 2023.
Majority of cybersecurity professionals believe offensive AI will outpace defensive AI
Seventy-six percent (76%) of cybersecurity professionals believe the world is very close to encountering malicious artificial intelligence (AI) that can bypass most known security measures.
Avnet Embedded launches solder-on OSM Size-S modules
Avnet Embedded presents the compact MSC OSM-SF-IMX93 OSM computing modules compliant with the new OSM 1.1 standard (Size-S) ‘Small’ with dimensions of 30 x 30mm.
ECSIPC smart retail turnkey solutions at GITEX 2023
ECS Industrial Computer (ECSIPC) is pleased to announce its participation in GITEX 2023 where it will showcase its latest smart retail turnkey solutions, new gaming and factory automation equipment, as well as its LIVA Z5 series family of mini PCs including LIVA Z5 Plus, LIVA Z5E Plus, and brand new LIVA Z5F Plus.
ECSIPC to showcase smart retail solutions at GITEX 2023
ECS Industrial Computer (ECSIPC) is pleased to announce its participation in GITEX 2023 where it will showcase its latest smart retail turnkey solutions, new gaming and factory automation equipment, as well as its LIVA Z5 series family of mini PCs including LIVA Z5 Plus, LIVA Z5E Plus, and brand new LIVA Z5F Plus.
OSM computing modules cut connector, cuts costs
The compact MSC OSM-SF-IMX93 OSM computing modules from Avnet Embedded are compliant with the new OSM 1.1 standard(Size-S) “Small” with dimensions of 30 x 30mm.
ULVAC-PHI launches sales of latest TOF-SIMS instrument 'PHI nanoTOF 3+'
ULVAC-PHI announce the launch of the PHI nanoTOF 3+. This new product release comes two years after its predecessor, the PHI nanoTOF 3. The new model builds upon the foundation of the PHI nanoTOF 3 and introduces the following three new features.
Semidynamics and SignatureIP create fully tested RISC-V multi-core environment and CHI interconnect
There is an ever-increasing demand for more powerful chip designs for advanced applications, such as AI and ML, that require many cores on one chip. To facilitate this, Semidynamics and SignatureIP have partnered to integrate their respective IPs to provide a fully-tested RISC-V, multi-core environment and CHI interconnect for the development of state-of-the-art chip designs.
thyssenkrupp selects Samotics for its steel manufacturing process
Samotics has been selected bythyssenkruppto monitor the condition and performance of its hot rolling mill in Duisburg.