Search results for "laser components"
3D printing advanced electronics
The National University of Singapore (NUS) has recently unveiled a new technique that has the potential to change the fabrication of 3D-printed circuits, and could significantly impact the future of electronics in sectors such as healthcare, communications, and security.
First recyclable plastic bicycle frame made by igus
igus has developed an injection moulded bicycle frame made of recyclable composite material for the e-bike manufacturer Advanced Bikes.
Polar Instrument releases new fault locator
The new GRS200 fault locator from Polar Instruments employs well-established passive analogue signature analysis to compare a faultless assembly with the board under test.
FLEXPOINT laser modules for long distances
LASER COMPONENTS offers the FLEXPOINT long-range series laser modules which can generate circular beam diameters from 0.5mm to 12mm at a distance from 1m to 200m.
Altus helps to enhance Nexperia's production capabilities
Altus Group has announced the successful implementation of the Essemtec Fox MFC Pick and Place system at Nexperia's Stockport facility.
LASER COMPONENTS introduces UV partner CrayoNano
LASER COMPONENTS expands its range of UV LEDs with products from CrayoNano from improved robustness.
ROHM develops one of the industry's smallest CMOS op amp
ROHM has developed an ultra-compact 1.8V - 5V, rail-to-rail CMOS operational amplifier (op amp) - the TLR377GYZ.
SMP255 Class X2 and SMP253 Class Y2 series at Rutronik
Rutronik has expanded its SMD capacitor product portfolio with KEMET's new “across the line” SMP255 capacitor series in safety class X2 and the optimised “line to ground” SMP253E series of RFI suppression capacitors (safety class Y2).
Take a new approach to ESD packaging for electronics
In the world of electronics manufacturing, ESD managers have the critical role of ensuring that components do not get damaged by electrostatic discharge (ESD). Corrosion protection is often a lower priority but should also be on the radar for manufacturers who want their electronics to reach the end user in good condition. Cortec has designed two-in-one ESD packaging solutions that meet both needs and is eager to turn the spotlight on EcoSonic ES...
Series 15 – Episode 7 – Enabling rapid photonic integrated circuit development
Paige West speaks with James Lee, CEO/Co-Founder, Wave Photonics, about photonic integrated circuits and the company’s overall mission.