Search results for "Specialty Coating Systems"

RDS have introduced two new COM-HPC modules from leading embedded computing solutions supplier, AAEON. The HPC-RPSC and HPC-ADSC modules are designed to deliver high performance computing for embedded applications. Supporting 12th and 13th generation Intel Core processors, the HPC-RPSC hosts more than 10 PCIe devices, a comprehensive high-speed I/O and expandable SSD-based storage.

The West ofScotland SpaceCluster, the newest addition to the UK’s thriving ecosystem of regional space clusters, launches ahead of Space-Comm Expo Scotland at SEC Glasgow 11–12 September, one of the year’s biggest UKspace industryevents.

TASKING, recently promoted toNXPGold Partner status, has enhanced its tools support to optimise and accelerate software development for NXP Semiconductors’ automotive microcontrollers and processors.

Semiconductor test equipment supplier Advantest will feature its leading-edge IC test solutions at the first-ever SEMICON India at the India Export Mart (IEML) in Greater Noida (Sept. 11-13).

Nidec announces that Nidec Group companies of Nidec Machine Tool Corporation, Nidec OKK, Takisawa Machine Tool, and PAMA, will exhibit their products at IMTS 2024, the largest manufacturing technology exhibition in the US, to be held in the city of Chicago, Illinois, from 9–14 September 2024.

KYZEN will exhibit at the SMTA Utah Expo & Tech Forum, scheduled to take place September 19 at Salt Lake City Marriott University Park in Salt Lake City, UT.

The newly introduced SEGGER Design Service helps companies that want to develop new or next-generation products, or reengineer existing ones, creating cost-effective applications that are precisely tailored to their needs.

A recent study by theUniversity of Glasgowhas introduced an ultra-thin material, called a "metasurface," designed to improve how satellites send and receive signals, particularly in the Ku, K, and Kafrequency bands.

Magnachip has announced the release of four new 40V MXT MV MOSFETs designed in Power Dual Flat No-Lead (PDFN) 33 packages for automotive applications.

What will the E/E (electrical/electronic) architecture in thevehicle of tomorrowlook like? And what requirements will this place on thesemiconductorsused?