Search results for "spectrum analysis"

While the hype behind smart cities may not be earth-shattering news, the fact is the technology that drives it keeps them relevant.

Siemens Digital Industries Software has introduced Calibre 3DThermal, innovative software for thermal analysis, verification, and debugging in 3D integrated circuits (3D-ICs).

CEA-Leti is delighted to announce the inaugural meeting today of the FAMES Pilot Line, a project designed to propel semiconductor technologies in Europe forward.

Siemens Digital Industries Software has announced the release of the Solido Simulation Suite software ("Solido Sim" software), an integrated suite of AI-enhanced SPICE, Fast SPICE, and mixed-signal simulators.

As the UK general election draws closer on the 4th July and the fate of the next government hangs in the balance, a major question being asked by design engineers everywhere is what the next government might mean for the industry.

Heraeus Electronics is pleased to announce its involvement in the FastLane project, a forward-thinking EU-funded initiative dedicated to transforming the European value chain for Silicon Carbide (SiC)-based power electronics.

Infineon Technologies AG has announced the company’s newAIROC CYW5591x Connected Microcontroller (MCU) product family.

The latest UN report, published in March 2024, highlights the alarming growth of electronic waste and the severe ecological and economic impacts it is causing.

Rohde & Schwarz has become the latest member of the recently formed AI-RAN Alliance.

Zapmap, the UK’s specialist charge point mapping service, has published new year-end figures for EV charge point installations in 2023.