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Renesas has introduced the RA8E1 and RA8E2 microcontroller (MCU) groups, extending its most powerful series of MCUs.

Yokogawa’s power meter underpins VDE system for ensuring accuracy of electric vehicle charging points.

OMRON has expanded its range of T-modules to support accurate measurements in all types of test equipment.

Authorised distributor Mouser Electronics is now shipping the HybridPACK Drive G2 modules from Infineon Technologies.

Farnell will showcase the best of industry’s solutions as part of Avnet City at electronica 2024 in Munich (November 12-15).

For the first time, Intel Core i processors with up to eight E-cores are now available on SMARC Computer-on-Modules. This allows even the smallest fanless low-power systems for extended temperature ranges to benefit from extremely powerful AI inference logic and enhanced virtualisation options, improving cyber security among other advantages.

In the dynamic world of optoelectronics, where light and electronics come together, connection technology plays a crucial role in the performance and lifespan of laser diodes (LD) and photodiodes (PD). Tresky is offering customised solutions that are specially tailored to the requirements of DIE bonding of laser- and photodiodes.

Advanced Energy has announced a joint initiative with distribution partner Sager Electronics that will speed the delivery of fully configured, modular power supplies for design and testing.

AI and Big Data Expo Globalannounces an esteemed line-up ofspeakersfor the expo, which will take place from 5-6 February 2025 at Olympia, London.

Join the webinar to learn how TI can help simplify and expedite your design process and transition to USB-C with their unmatched products, technical expertise and design resources for industrial and automotive applications.