Search results for "NTT Corporation"
Rochester Electronics partners with Toshiba Electronic Devices & Storage Corporation
Rochester Electronics is partnering with Toshiba Electronic Devices & Storage Corporation. Toshiba semiconductors and storage products support a wide range of industrial, automotive, and consumer applications.
Results of joint research into hydrogen energy solutions published
A review article by a team of researchers supported by the Toyota Mobility Foundation (TMF) has been published in the International Journal of Hydrogen Energy, a world-renowned scientific journal issued by the Dutch academic publisher Elsevier.
NEC touts "truly open, truly trusted" approach to network ecosystems for 5G
NEC Corporation will demonstrate its commitment to Open Networks, and support for the growth of Open RAN 5G, at Mobile World Congress (MWC) 2023 in Barcelona, Spain. NEC will welcome guests to its exhibit to discuss how it's helping to accelerate innovation via open networks and promoting global digital transformation that can deliver social value.
Indium Corporation to host webinar on material technology
Indium Corporation's Joe Hertline, Product Manager for Engineered Solder Materials (ESM)/Power Electronics, will host a webinar to discuss an emerging material technology which has the ability to provide robust tacking strength while reducing dependency on customised fixturing. The webinar, a part of the company's InSIDER Series, will be held live at 8:30am EST, February 28th and made available for on-demand viewing afterward.
1200W full-brick DC/DC converters have 200 to 425V input and 94% efficiency
TDK Corporation announces the introduction of the TDK-Lambda PH1200A280 full-brick DC/DC converters for use with HVDC (high voltage direct current) input voltages from 200 to 425Vdc.
Indium Corporation introduces China Country Sales Manager
Indium Corporation is pleased to introduce Taylor Wang Yong Xing as the company’s China Country Sales Manager.
UMC and Cadence collaborate on 3D-IC hybrid bonding reference flow
United Microelectronics Corporation (UMC) and Cadence have announced that the Cadence 3D-IC reference flow has been certified for UMC’s chip stacking technologies, enabling faster time to market.
WAGO: The smart way of label printing
Specially designed for switchboards, WAGO’s new smart thermal transfer label printer is now available from Conrad Electronic.
3G ending: an obituary for the first mobile broadband network
3G, the once revolutionary network that ushered in a new era of mobile connectivity usage, iscoming to a close.As telecoms companies across major economies begin shutting down their 3G coverage, with the US, India and China having now largely completed their process, and two of the UK's 'Big Four' mobile service pledging to end its coverage in the UK by 2023, the network enters its twilight years.
DOCOMO trials transmissive metasurface on windows to improve connectivity
NTT DOCOMO has announced that it has succeeded in what it believes to be the world's first trial of redirecting millimetre-band 28 GHz radio waves coming from inside a building to the foot of the building outdoors by bending the radio waves with a film-shaped transmissive metasurface attached to a window surface. The trial was conducted from October to November 2022 at their R&D Centre in Yokosuka, Japan, aiming at the realisation of advanced...