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Indium Corporation introduces China Country Sales Manager
Indium Corporation is pleased to introduce Taylor Wang Yong Xing as the company’s China Country Sales Manager.
UMC and Cadence collaborate on 3D-IC hybrid bonding reference flow
United Microelectronics Corporation (UMC) and Cadence have announced that the Cadence 3D-IC reference flow has been certified for UMC’s chip stacking technologies, enabling faster time to market.
Zytronic invests in equipment for future growth plans
Zytronic has invested almost £400k in a second bespoke laser soldering system installed within another factory cleanroom.
All new SMART Board QX Pro series and partnerships set the stage for better collaborative hybrid work
SMART Technologies have announced at ISE the launch of an all-new interactive display for the business market, the SMART Board QX Pro interactive display.
Automating wedge bonding for complex wire components
Further automating investment increases accuracy and offers cost-saving benefits.
Heraeus Electronics showcases next-generation power electronics and semiconductor packaging at SEMICON Korea 2023
For the first time, Heraeus Electronics will exhibit at SEMICON Korea, scheduled to take place 1st – 2nd February 2023, at COEX in Seoul, Korea. At the exhibition, Heraeus Electronics will show a wide range of innovative materials to enhance power modules and semiconductor device performance.
Brewer Science presents optics integration at SPIE Photonics West
Brewer Science has presented ideas to optical integration challenges at the SPIE Photonics West Exhibition in San Francisco, California.
ASMPT launches first European centre of competence for semiconductor solutions
ASMPT has opened its first European SEMI Centre of Competence (CoC) in Regensburg, Germany. This latest facility adds to a network of R&D and innovation facilities across the world, serving European customers as a key proof-of-concept facility for innovations and applications for its broad semiconductor solutions (SEMI) portfolio, and a direct point of contact for the efficient and rapid transfer of knowledge.
Relec showcases power products and display at Southern Manufacturing 2023
Relec Electronics is exhibiting its range of displays and power products at Southern Manufacturing & Electronics 2023 at Farnborough International, 7th to 9th January.
Heraeus Electronics provides latest materials portfolio at NEPCON Japan 2023
Heraeus Electronics returns to NEPCON Japan after two years of the pandemic. At the exhibition, which is scheduled to take place 25th to 27th January 2023, at The Tokyo Big Sight, Heraeus Electronics will bring a wide range of innovative materials to enhance power module and semiconductor device performance.