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ASRock Industrial has released a 4X4 BOX 8040 series of mini PCs and 4X4 8040 motherboard series, powered by AMD Ryzen 8040 series APUs, crafted to elevate trusted performance and AI PC capabilities.

SemiQ has expanded its QSiC power modules portfolio with the introduction of a new series of 1200V SiC power MOSFETs in half-bridge packages.

Extreme H, set to be the world’s inaugural hydrogen-powered motor racing championship, is set to kick off in 2025.

Edinburgh-based Dukosi says former BMW executive Stefan Juraschek and Dr Anna Stefanopoulou, William ClayFordProfessor of Technologyin the Department of Mechanical Engineering at the University of Michigan, will join Bob Galyen on the Dukosi Technical Advisory Board (TAB).

Advantest will feature its latest test solutions at SEMICON Japan 2023 at the Tokyo Big Sight (December 13-15).

A plan by ROHM and Toshiba Electronic Devices and Storage to collaborate in the manufacture and increased volume production of power devices has been recognised and will be supported by the Ministry of Economy, Trade and Industry as a measure supporting the Japanese Government’s target of secure and stable semiconductor supply.

The Chomerics Division of Parker Hannifin Corporation has launched two high-performance, high-reliability, fully cured dispensable thermal gels.

Mouser Electronics has released a new eBook in collaboration with TE Connectivity exploring EVs and the rapidly evolving landscape of connected transportation.

Semiconductor test equipment supplier Advantest has added three products to its suite of memory test products.

Infineon has launched the TDA388xx family, targeting the server, AI, datacom, telecom, and storage markets.