Search results for "fibre optic"

Vishay Intertechnology has broadened its optoelectronics portfolio with the introduction of a new high speed silicon PIN photodiode with enhanced sensitivity for visible light.

Quantifi Photonics has announced the launch of its QCA Series High-Speed Communication Analyzer at DesignCon 2024. This development marks a significant step forward in advancing interconnect technologies for high-volume manufacturing, particularly in the fields of AI, High-Performance Computing, and Cloud applications.

Scintil Photonics will demonstrate its latest technology, a single-chip multi-port 100GHz DFB (Distributed FeedBack) Comb Laser Source for high-performance computing and AI applications, at booth #3351 during OFC 2023.

MKS has announced Newport replicated freeform mirrors, non-rotationally symmetric reflective mirrors for use in advanced optical systems.

Keysight is enabling the University of Stuttgart to conduct foundational research essential to the development of new integrated circuits (IC) for 6G technology with the new Keysight 6G Vector Component Analysis (VCA) solution. This is the latest collaboration between Keysight and the University of Stuttgart's long-time research relationship.

Researchers have reported the first 3D measurements acquired with quantum ghost imaging. The new technique enables 3D imaging on a single photon level, yielding the lowest photon dose possible for any measurement.

Lumus, an innovator in reflective waveguide technology for augmented reality (AR) eyewear, announced the expansion of its five-year partnership with SCHOTT, an international technology group and manufacturer of high-tech materials and optics, including SCHOTT RealView high-index wafers and reflective waveguides. This expansion aims to cater to the increasing global demand for optical AR glasses.

Infineon, in partnership with OMS and pmdtechnologies, has developed a new hybrid Time of Flight (hToF) solution that enables enhanced depth sensing and 3D scene understanding for next-generation smart consumer robots.

Ventec has announced that its VT-901 polyimide material is now fully and exclusively qualified by ESA in ACB Belgium’s manufacture of High-Density Interconnect (HDI) PCBs.

Overhalf of the 9.2 billion tonnes of plastic manufactured since the 1950s has ended up as waste, contributing to the growing environmental crisis we face today.