Search results for "circuit breakers"
Trio announce reference flow for 4 nm RF FinFET process
Keysight Technologies, Synopsys, and Ansys have announced a new reference flow for the TSMC N4PRF, the would number one semiconductor foundry's advanced 4 nanometer (nm) radio frequency (RF) FinFET process technology.
G+D and Sony launch remote SIM provisioning of iSIMs
The integrated SIM (iSIM) is an important evolutionary step in SIM technology, empowering simple and cost-efficient connection, deployment, and go-to-market for Internet of Things (IoT) devices.
Duo unveil remote provisioning of iSIMs solution
The integrated SIM (iSIM) is an important evolutionary step in SIM technology, empowering simple and cost-efficient connection, deployment and go-to-market for Internet of Things (IoT) devices.
New miniature medically approved AC-DC modules offer up to 40W
XP Power announces the release of a family of single output, PCB mounting AC-DC modules with power ratings from 3W to 40W that offer easy integration into BF (body floating) applications.
New compact VCSEL proximity sensor for wearable devices
ROHM has developed a compact 2.0mm × 1.0mm proximity sensor, the RPR-0720, optimised for applications requiring attachment/detachment and proximity detection.
3D-circuits - enabling 3D-placement of electronic components
Modern electronic assemblies are becoming more complex with an increasing number of components. This makes it difficult to fit all parts into the limited space available for printed circuit boards (PCBs).
Microchip introduces first low pin count MCU family with I3C support
With the step-function increase in data collected and transmitted from cloud-connected edge nodes, Improved Inter Integrated Circuit (I3C) is rapidly becoming a more sustainable solution for interfacing sensors with a high data rate and will help expand capabilities in next-generation devices.
ConductRF RF cable assemblies at EuMw 2024
ConductRF has announced they are exhibiting at the industry’s premier event in Europe, European Microwave Week, in Paris, France, September 22nd-27th, 2024.
Molex introduces thermal management for data centres
Molex has introduced a new thermal management innovation aimed at reducing both the time and cost associated with deploying and upgrading high-performance data centres.
PPI announces expanded variable capacitors
PPI has announced a new expanded range of film trim and 3mm trimmer capacitors.