Search results for "Indium Corporation"

During MWC Barcelona 2023 Qualcomm Technologies and NEC Corporation highlighted their continued commitment to push the commercialisation of next-generation networks with the introduction of the latest 5G vDU from NEC.

As part of its showcase at MWC Barcelona 23, Fujitsu has revealed its progress in a series of connectivity trials conducted in cooperation with Microsoft Corporation (hereinafter Microsoft) to verify the connectivity between Fujitsu's 5G network technology and Microsoft Azure private MEC.

Electronic Specifier takes a look at the top power products to have been released in February 2023.

IAR announces its full support for the latest CYT6BJ series from Infineon’s TRAVEO T2G Body MCU family.

This year WES be celebrating the amazing work that women engineers around the world are doing to #MakeSafetySeen.

Vicor Corporation have announced its distribution agreement with Avnet.The agreement expands access to Vicor’s power modules through Avnet’s design and supply chain.

The Chomerics Division of Parker Hannifin Corporation has released THERM-A-GAP PAD 70TP, an ultra-soft (15 Shore hardness), thermally conductive gap filler pad to meet the demands of a wide range of demanding industrial applications.

Vicor Corporationhas announced its distribution agreement withAvnet, a global distributor of electronic components and services.

Cisco and NEC Corporation has announced plans to expand their collaboration efforts to include system integration solutions and potential opportunities in 5G xHaul and private 5G to help customers transform their architecture and connect more people and things.

Sierra Wireless, a subsidiary of Semtech Corporation and global IoT solutions provider, has announced its latest HL Series LPWA module, the 5G HL7900, for next-generation use cases needing ultra-low power, increased device longevity and support for 3GPP’s latest 5G standards.