Search results for "module"

As portable electronics expanded in the consumer and industrial markets, so did the number of connectors. Multiple Universal Serial Bus (USB) standards, combined with proprietary connectors from manufacturers, resulted in a variety of incompatible cables, all of which fulfilled similar functions. There has been a background effort from the European Union as well as some industry leaders to move to a single unified solution to simplify the situati...

With migration to the Internet of Things (IoT), security has moved well beyond an optional feature in embedded applications. To respond to a growing array of security specifications, developers require solutions that not only match application requirements for low power or high performance but can also deliver hardware-based security capabilities.

Silicon Labs recently unveiled a new collaboration with Arduino aimed at enhancing the development of Matter over Thread applications for Arduino's developer community, which numbers 33 million.

Indium Corporation is set to present three insightful contributions at APEC 2024, taking place from 25-29 February in Long Beach, CA. These presentations, delivered by distinguished members of the Indium Corporation team, will delve into various aspects of the power electronics assembly industry.

u-blox has announced two new LTE-M cellular module series, the SARA-R52 and LEXI-R52, designed for industrial applications.

Authorised distributor Mouser Electronics is now stocking the Nitrogen8M PlusSMARC from Boundary Devices.

Avnet has released the Avnet RFSoC Explorer Toolbox Version 3.0, which now includes support for over-the-air antenna to bits prototyping with the 5G mmWave Phased Array Antenna Module (PAAM) Development platform.

At the upcoming APEC 2024, taking place from 25-29 February in Long Beach, California, Indium Corporation is set to exhibit a range of its high-reliability materials designed for automotive and power electronics applications, including those used in electric vehicle manufacturing.

Advantech introduced the EI-53 edge computing system, now available. The EI-53 is powered by 13th Gen Intel Core Mobile processors with up to 10 cores and DDR5 5200MHz dual-channel memory up to a maximum capacity of 64GB. It also features high-performance Intel Iris Xe integrated graphics.

The STMicroelectronics Teseo-LIV4F GNSS module leverages ST’s Teseo IV single-die receiver technology, including L1 and L5 frequency-band support, to provide positioning accuracy better than one meter in embedded geolocation systems.