Search results for "microelectronics"
Fault-tolerant MCUs suit safety-critical in-car use
Utilising an in-house 40nm embedded Flash process, ST Microelectronics has added several devices to its multi-core MCU family, aimed at making cars safer.The automotive MCUs combine ISO 26262 ASIL-D compliance, encryption for security and increased memory size for the storage of vital programmes and data, strengthening ST’s line of fault-tolerant MCUs for demanding in-car applications.
Infineon demonstrates how it supports secure Industry 4.0
Microelectronics is the key enabling technology for Industry 4.0, the networked production of the future. At the Hannover Messe, Infineon Technologies demonstrates how it supports a secure Industry 4.0.
Production concept could give rise to new types of LEDs
A fully optimised production concept for LED components and light modules in which all the process steps are co-ordinated with one another could give rise to completely new types of LEDs and reduce their manufacturing costs.
Mixed signal methodology offers high automation
The Intelligent IP Mixed Signal Design Flow methodology developed by the Design Automation group at the Fraunhofer Institute for ICs IIS offers an unparalleled degree of automation, especially for the otherwise time-consuming, error-prone analogue portion of the design.Mixed-signal ICs are found in many of today's microelectronics, from safety-critical automotive applications to medical and aerospace systems.
Demand for smaller & cheaper mixed signal technology
The demand for smaller and cheaper mixed-signal technology is growing. Steve Rogerson looks at how the industry is rising to the challenge.
Full Service Foundry presents sensors for electronic trends
At the GSA Silicon Summit 2015, ams’ Full Service Foundry division presented its comprehensive sensor technology and solutions portfolio which provides foundry customers a complete tool set to develop advanced sensor solutions today’s electronic megatrends.
SMT Hybrid Packaging features special open workshop
Two conference sessions, two workshops and 17 German and English tutorials concerning all aspects of system integration in microelectronics make up the programme at SMT Hybrid Packaging 2015 on 5th to 7th May.
CS International assembles its strongest ever line-up of speakers
CS International hit a new high by assembling its strongest ever line-up of speakers. At the meeting, more than 300 delegates gained great insight into the potential of various aspects of the compound semiconductor industry, thanks to presentations from seven leading market analysts.
ST augments Chinese digital lifestyle
At electronica China, March 17th to 19th in Shanghai, STMicroelectronics will showcase its latest technologies and products for the IoT and a smarter world. Hall 3 Booth 3402, ST will demonstrate solutions which help deploy microelectronics more widely, creatively and cost-effectively, addressing key societal challenges as well as enriching people’s lives.
Products on display at trade fair aim to simplify selective soldering
SolderStar has announced that it will highlight a number of products, including its latest advancement in selective soldering, at SMT Hybrid Packaging. The increasing use ofmicroelectronics has ramped up its complexity, and this brings with it manufacturing problems, especially when soldering.SolderStar will exhibit a range of products aiming to simplify the selective soldering process, including the WaveShuttle Selective range.