Search results for "intel"
Robotic security use cases and implementation for a secure future
In this article, Manoj Rajashekaraiah, Principal Engineer, Analog Devices will provide an overview of the components that constitute an industrial robot/cobot.
Swindon Silicon Systems to exhibit at SENSOR+TEST 2024
Swindon Silicon Systems, a mixed signal ASIC specialist and a Sensata Technologies company, will exhibit at SENSOR+TEST 2024 at the Nuremberg Exhibition Centre, Germany from 11–13 June, 2024.
Seica Battery show Stuttgart
SEICA is pleased to announce that they will once again be present at the Battery show in Stuttgart at Booth B16 in Hall 8, displaying the latest innovative test solutions developed specifically for the EV sector.
BYD presents new energy portfolio at The Smarter E Europe
BYD, one of the world’s largest manufacturers of rechargeable batteries and a global market pioneer for electrical vehicles and new energy solutions, will present an overview on solutions from the company’s renewable energy and zero emission portfolio at‘The Smarter E Europe’from 19–21 June 2024.
ITTIA announces compatibility with Elektrobit products
ITTIA announces its compatibility with Elektrobit’s corbos Linux built on Ubuntu. The ITTIA DB product family offers robust software for real-time data processing, management, and analysis on Electronic Control Unit (ECU) devices, providing integrated database solutions for vehicle manufacturers developing intelligent, data-sensitive applications.
New Honeywell solution jumpstarts gigafactories from day one
Honeywell has announced the launch of its Battery Manufacturing Excellence Platform (Battery MXP), an AI-powered software solution designed to optimise gigafactory operations from the outset.
Alphawave, Samsung partnership extended to 2nm processes
Alphawave Semi has expanded its strategic partnership with Samsung Foundry. The expanded agreement encompasses leading-edge IP for PCI Express 7.0, 112G and 224G Ethernet and the latest UCIe (Universal Chiplet Interconnect Express) die-to-die interconnect standard that is enabling next-generation SoC (system-on-chip) technologies for AI and other HPC systems.
Leapmotor and Ambarella announce strategic cooperation agreement
Leapmotor and Ambarella, Inc. have recently signed a strategic cooperation agreement. The two companies aim to create a first-class intelligent driving experience for the global new energy vehicle market.
Synthetic diamond for high-powered electronics
Element Six (E6) and Orbray announced a strategic collaboration to deliver the world’s highest quality wafer-scale single crystal (SC) synthetic diamond.
About:Energy accelerates battery management system innovation
About:Energy revealed a technology demonstrator for battery management systems developed with support from STMicroelectronics.