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The United Kingdom Atomic Energy Authority (UKAEA) has recently enhanced its Remote Handling Control Room, significantly advancing its capability to undertake fusion repurposing and decommissioning projects to the highest standards.

Advanced Energy Industries (AE) will showcase its latest innovations in power and monitoring at the Applied Power Electronics Conference (APEC) in Long Beach, California (February 25-29).

HARMAN has announced the launch of the Ready Connect 5G Telematics Control Unit (TCU), leveraging Snapdragon Digital Chassis connected car technologies from Qualcomm Technologies to push connectivity boundaries and democratise the automotive connectivity landscape.

The US Department of Commerce has allocated $35 million in initial funding to BAE Systems for the modernisation of their Microelectronics Centre (MEC) in Nashua, New Hampshire.

Mechnano proudly announces the nomination of Olga ‘Dr. O’ Ivanova, Director of Applications and Technology at Mechnano, for the prestigious TCT Women in 3D Printing Innovator Award.

Henkel has strengthened its distributor partnership with Alstom Rail for its on-site training.

dSPACE has unveiled the mew MicroLabBox II,a development system for RCP and HIL applications.

Odysseus has established itself as the inaugural private spacecraft to softly land on the moon, pioneering commercial lunar missions and beyond.

"The largest green hydrogen projects that are currently under development are in Europe. The reason is that after the war in Ukraine, Europe realised it needed its own resources. Despite that, China is one of the main countries investing in green hydrogen."

Mouser Electronics is inviting its customers to join the Intel FPGA Vision Webcast hosted by Intel Programmable Solutions Group (PSG) Chief Executive Officer Sandra Rivera and Chief Operator Officer Shannon Poulin.