Search results for "TRI"

French MedTech BodyCAP has developed the pioneering eCelsius Performance Connect System, centred around a connected ingestible thermometer for Sports and Occupational Health Research applications, whose connectivity to smartphones and tablets is provided by Insight SiP’s ISP1807-LR RF module.

Lauterbach’s TRACE32 development tools now support the HighTec Rust Compiler, tailored for Infineon AURIX TC3x and TC4x microcontrollers.

PHABRIX has announced that its Distributor Partner for Australia, AV Group Technologies, will be exhibiting several of its products at the relaunched METexpo show.

The AI-RAN Alliance has been launched at the GSMA Mobile World Congress in Barcelona, heralding a significant step forward in the fusion of artificial intelligence (AI) with cellular technologies to enhance radio access network (RAN) and mobile network capabilities.

IDTechEx discusses its latest findings in advanced semiconductor packaging trends in AI and HPC.

dSPACE has unveiled the mew MicroLabBox II,a development system for RCP and HIL applications.

Satellite communications company Hanwha Phasor and Lufthansa Technik, one of the global leading providers of technical aircraft services, have partnered to deliver advanced in-flight connectivity for commercial flights.

Odysseus has established itself as the inaugural private spacecraft to softly land on the moon, pioneering commercial lunar missions and beyond.

NOVOSENSE Microelectronics, a semiconductor company specialising in high-performance analog and mixed-signal integrated circuits (ICs), has launched its new NSOPA series of general-purpose operational amplifiers.

A looming artefact of the pandemic, the global chip shortage, seems to be easing up; demand for consumer products like smartphones and games consoles has dropped and chip sales have slowed due to increased inflation. But are we out of the woods just yet?